Stacked package device and manufacturing method thereof

Abstract

The invention discloses a stacked packaging device. The stacked packaging device comprises a plurality of packaging assemblies which are installed together in a stacked mode. Each packaging assembly comprises a substrate provided with a first surface and a second surface, a groove formed in the first surface of the substrate, a semiconductor chip arranged in the groove, and an inner sealing material allowing the semiconductor chip to be sealed into the groove, wherein the upper surface of the semiconductor chip is lower than the first surface of the substrate, and the upper surface of the inner sealing material is basically flush with the first surface of the substrate. Each packing assembly further comprises a plurality of connecting parts which are connected to the second surface of the corresponding substrate. When every two adjacent packaging assemblies are installed in a stacked mode, the connecting parts of the upper packaging assembly are electrically connected to the first surface of the substrate of the lower packaging assembly. Therefore, the upper surface of each packaging assembly is of a full-flat structure, and the difficulty of the later stacked packaging is lowered, and more ways are provided for the subsequent stacked packaging.

Description

technical field [0001] The present invention relates to the field of semiconductor packaging, in particular to a multilayer package on package (Package on package, POP for short) device and a manufacturing method thereof. Background technique [0002] As the size of electronic devices decreases, high integration density can be achieved by stacking a plurality of chips in one semiconductor package or stacking a plurality of individual semiconductor packages. Recently, stacked semiconductor packages have been introduced for mobile electronic device applications and the like. One of the stacked semiconductor packages is a package-on-package (POP) in which a logic package device and a memory package device are stacked. Using the POP technology, different types of semiconductor chips can be included in one semiconductor package. [0003] However, the multi-layer stacked packaging devices in the prior art are not easy to expand, and the number of stacked layers is limited. If th...

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Problems solved by technology

[0003] However, multi-layer stacked packaging devices in the prior art are not easy to expand, and the number of stacked layers is limited. If it is necessary to increase the number of stacked layers, it is necessary to modify the design of the packaging components of all other layers, and it is also necessary to modify the entire stacked device. Large-scale adjustment of the production line and process, the cost is high

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