Method and system for processing fragile material

A brittle material and processing system technology, applied in stone processing equipment, stone processing tools, metal processing equipment, etc., can solve the problems that affect the processing accuracy, difficult to control the quality, and increase the processing time, so as to achieve a smooth fracture surface and save energy. The effect of high processing time and high stability

Inactive Publication Date: 2014-02-19
BEI TECH INC
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Problems solved by technology

[0005] In addition, if non-contact lasers are used to process brittle materials, although brittle materials with complex shapes can be formed, the processing time required for laser modification processing is long, especially when the material thickness increases. The processing time will increase, which will affect the production efficiency virtually
Furthermore, since laser processing forms processed products through high-temperature melting or vaporization, the quality of the edges of processed products will be difficult to control due to high temperature. In addition, the size of the high-energy beam will also affect the processing accuracy.

Method used

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  • Method and system for processing fragile material
  • Method and system for processing fragile material
  • Method and system for processing fragile material

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Embodiment Construction

[0041] see Figure 1A As shown, this figure is a schematic diagram of an embodiment of the brittle material processing system of the present invention. The brittle processing system 2 includes a platform 20 , a jig 21 , an impact tool 22 and a power source 23 . The platform 20 supports a substrate 9 made of a brittle material, and a fracture profile 90 is formed on the surface or inside of the substrate 9 . The brittle material can be selected as glass, ceramics, crystalline material, etc., but not limited thereto. The crystalline material can be gemstone or silicon substrate. In addition, it should be noted that the surface of the substrate can have a reinforced structure layer, such as: metal coating or directly form a reinforced structure layer by material treatment of a specific thickness on the surface of the substrate to achieve wear resistance and scratch resistance. And not easy to break and other effects. The strengthening structure layer can be formed on a single ...

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Abstract

The invention provides a method and a system for processing a fragile material. A base material composed of the fragile material is provided, a damaged outline is formed on a surface or on inner portion of the base material, and then the base material with the damaged outline is placed on a platform, a protruding structure of a jig is abutted to the surface of the base material corresponding to the damaged outline through the jig with the protruding structure, and finally, an impact tool applies an impact force to the jig so that the fragile material corresponding to the damaged outline separates from the base material. By the aid of the method and the system, time and cost for processing and forming the fragile material of a certain outline can be saved.

Description

technical field [0001] The invention relates to a processing method and system, in particular to a brittle material processing method and system. Background technique [0002] Brittle materials have been widely used in the electronics industry, whether in the semiconductor industry or 3C electronic products, the application of brittle materials can be seen. [0003] Generally speaking, the processing methods of brittle materials can be basically divided into contact processing or non-contact processing. In the method of contact processing, diamond or diamond tools are generally used to carve damage marks on the surface of brittle materials, and then apply force along the marks to break. As for the non-contact processing method, you can use a high-energy beam, such as a laser, to focus directly on the surface of the brittle material, modify the brittle material by high temperature (for example: melting or vaporization), and then By moving the beam, the moving path of the be...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/00B28D1/22B23K26/36C03B33/02
Inventor 杨友财
Owner BEI TECH INC
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