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igbt module top cover installation aids

A technology of installation assistance and top cover, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as failure to meet inspection standards, excessive gap between top cover and shell, glue leakage, etc., to reduce waste and reduce Time-consuming, easy-to-operate effects

Active Publication Date: 2016-06-29
XIAN YONGDIAN ELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In view of this, the purpose of the present invention is to provide a tool for assisting in the installation of the IGBT module top cover, to overcome the small deformation of the top cover when the IGBT module is packaged, causing the gap between the top cover and the shell to be too large, resulting in glue leakage, which cannot The problem of meeting the inspection standard

Method used

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Embodiment Construction

[0025] The invention discloses an auxiliary tool for installing the top cover of an IGBT module, which comprises a base plate, two sets of columns vertically arranged on the base plate, and a first beam and a second beam respectively arranged on the columns. The upright column and the base plate enclose the accommodation space, the first beam and the second beam are arranged parallel to the base plate, each first beam is provided with at least two wing nuts, and the top ends of the wing nuts are connected to the second beam , the second beam moves up and down along the column through the rotation of the butterfly nut.

[0026] Preferably, each of the first beams is provided with two wing nuts.

[0027] In the above technical solution, the two sets of columns are arranged on the bottom plate in parallel.

[0028] In the above technical solution, the first beams on the two sets of uprights are equidistant from the bottom plate.

[0029] In the above technical solution, a plura...

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Abstract

The invention relates to the technical field of semiconductor device packaging, and discloses an auxiliary tool for installing an IGBT module top cover, which includes a base plate, two sets of columns vertically arranged on the base plate, and a first beam and a second beam respectively arranged on the columns. Two beams, the two sets of columns and the base plate enclose the accommodation space, the first beam and the second beam are arranged parallel to the base plate, each first beam is provided with at least two butterfly nuts, and the wing nuts The top of the nut is connected to the second beam, and the rotation of the butterfly nut drives the second beam to move up and down along the column. The auxiliary tool is easy to operate, can reduce time consumption during work, avoids replacing the top cover of the IGBT module due to excessive gaps, and reduces unnecessary waste.

Description

technical field [0001] The invention relates to the technical field of semiconductor device packaging, in particular to a tool for assisting in the installation of the top cover of an IGBT module. Background technique [0002] Insulated Gate Bipolar Transistor (Insulated Gate Bipolar Transistor, referred to as IGBT in full) has the performance characteristics of high frequency, high voltage, high current, especially easy to turn on and off, and is internationally recognized as the most representative of the third revolution of power electronics technology. The revolutionary product has been developed to the sixth generation so far, and the commercialization has been developed to the fifth generation. At present, IGBT has been widely used in various industries of the national economy. [0003] The IGBT module is mainly used in the main circuit inverter of the frequency converter and all inverter circuits, that is, in DC / AC conversion. Today's new power electronic devices re...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/50
Inventor 任杰
Owner XIAN YONGDIAN ELECTRIC