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Guard ring structure for preventing short circuit of test structure when packaging

A technology for testing structures and protection rings, which is applied in the direction of circuits, electrical components, electrical solid devices, etc.

Active Publication Date: 2016-06-01
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The technical problem to be solved by the present invention is to provide a method for preventing structural short circuit caused by contact between the metal connection ball and the protection ring when the metal connection ball is partially hit outside the metal pad in view of the above defects in the prior art. Guard ring structure to prevent short circuit of test structure during packaging

Method used

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  • Guard ring structure for preventing short circuit of test structure when packaging
  • Guard ring structure for preventing short circuit of test structure when packaging
  • Guard ring structure for preventing short circuit of test structure when packaging

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Embodiment Construction

[0031] In order to make the content of the present invention clearer and easier to understand, the content of the present invention will be described in detail below in conjunction with specific embodiments and accompanying drawings.

[0032] In order to prevent the short circuit between the metal connection ball and the guard ring during wiring, the present invention designs a new guard ring, which surrounds the test structure from the bottom metal layer and connects to the second-most metal layer layer by layer. But for the uppermost metal layer, the protective ring does not completely surround the structure, and there are no metal rings on both sides of the metal pad connected to the structure, so that the short circuit between the metal connection ball and the protective ring can be completely avoided during wiring.

[0033] Figure 7 A top view of the protection ring structure according to the embodiment of the present invention is schematically shown. Figure 10 A cross...

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Abstract

The invention provides a protecting ring structure for preventing a test structure short circuit during packaging. The protecting ring structure comprises laminated structure rings which surround one or more metal pads. The laminated structure rings comprise a plurality of metal layers and a plurality of through hole layers which are arranged in an alternating-laminating mode layer by layer from a bottom metal layer and a bottom through hole layer to a top metal layer and a top through hole layer. One or more openings are formed in the top through hole layer and the top metal layer in the laminated structure rings, and the one or more openings correspond to the one or more metal pads.

Description

technical field [0001] The present invention relates to the field of semiconductor manufacturing, and more specifically, the present invention relates to a guard ring structure for preventing short circuit of test structure during packaging. Background technique [0002] When the test structure needs to be tested at the package level, metal wires will be connected to the pins of the ceramic base on the corresponding metal pads, such as figure 1 The shown ceramic base, 1 is the test structure placement area, 2 is the pin of the ceramic base. figure 2 It is an enlarged view of a test structure after packaging (21 is a test structure metal pad, 22 is a metal wire, and 23 is a metal connection ball punched on the metal pad. [0003] For some structures on the wafer, in order to prevent water vapor from entering during dicing and packaging or other operations, a metal protection ring 100 will be designed around the structure, such as image 3 shown. [0004] Image 6 A cross...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/58
Inventor 赵敏尹彬锋周柯
Owner SHANGHAI HUALI MICROELECTRONICS CORP