A surface mount memory socket welding detection device and method

Abstract

The embodiment of the invention provides a surface-mount memory bank socket welding detection device and method. The surface-mount memory bank socket welding detection device comprises a first detection circuit board and at least one second detection circuit board, wherein the first detection circuit board is inserted in a surface-mount memory bank socket of a surface-mount memory bank socket group and used for providing an initial electric signal to all surface-mount memory bank sockets in the surface-mount memory bank socket group; the at least one second detection circuit board is inserted in other surface-mount memory bank sockets of the surface-mount memory bank socket group respectively and used for extracting a pin electric signal from the surface-mount memory bank socket in which the second detection circuit board is, comparing the extracted pin electric signal with the initial electric signal, and determining a welding condition of each pin according to a comparing result and a correspondence relation of welding conditions of pins. Thus, the detection device provided by the embodiment of the invention is capable of determining the welding condition of the pins of the surface-mount memory bank sockets through a simple electric signal comparing result, and is simple in realizing mode, low in cost and strong in reliability.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a device and method for detecting welding of a surface-mounted memory socket. Background technique [0002] In the production and processing stage, the traditional plug-in memory socket is inserted into the through hole of the printed circuit board (Printed Circuit Board, PCB) through the dense pins under the body to be soldered and fixed; while the surface mount memory socket is in the production and processing stage, the body The soldering method of the lower pins is similar to the usual surface mount resistors. Due to the dense pins of the surface mount memory socket, this soldering method is prone to false soldering and missing soldering, which also creates technical difficulties in the processing process. [0003] In the existing technology, automatic optical inspection (Automatic Optic Inspection, AOI) equipment is used to detect the phenomenon of virtual soldering and ...

AI Technical Summary

Problems solved by technology

Because the memory socket pins (also called: PIN pins) and PCB pads are covered by the socket body, the pins are not visible during detection

Therefore, the existing technology still needs to rely on manual visual inspection after the detection of virtual solder leakage through AOI equipment. The detection method is relatively complicated, and the reliability of manual visual inspection itself is not high.

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