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A kind of LED flexible board light source module and manufacturing method thereof

A technology of LED light source and light source module, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems affecting the light output efficiency and service life of LED light sources, the increase of heat dissipation channels of LED light sources, and the poor heat dissipation of LED light sources, etc., so as to avoid Poor heat dissipation, realize the separation of electricity and heat, and improve the effect of heat dissipation

Active Publication Date: 2017-02-22
北京半导体照明科技促进中心
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existence of the insulating layer will increase the heat dissipation channel of the LED light source, which will increase its thermal resistance and lead to unsatisfactory heat dissipation, and eventually cause the LED light source to have premature light decay due to poor heat dissipation
This seriously affects the light extraction efficiency and service life of the LED light source

Method used

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  • A kind of LED flexible board light source module and manufacturing method thereof
  • A kind of LED flexible board light source module and manufacturing method thereof
  • A kind of LED flexible board light source module and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] Such as figure 1 As shown, the LED flexible board light source module provided in this embodiment includes: LED light source 1, which is arranged on the soft substrate 2; heat dissipation member 3, on which the soft substrate 2 is arranged; conductive member 4, which covers on the soft substrate 2 and the heat dissipation member 3 , and the conductive member 4 is electrically connected to the soft substrate 2 .

[0052] It installs the LED light source 1 on the soft substrate 2, then arranges the soft substrate 2 on the heat dissipation member 3, and uses the conductive member 4 to electrically connect the soft substrate 2, so that the LED light source 1 can dissipate heat through the heat dissipation member 3, Conducting electrical conduction through the conductive member 4, thereby realizing the separation of electricity and heat, improving the heat dissipation effect of the LED light source 1, effectively avoiding the problem of premature light decay of the LED light...

Embodiment 2

[0062] The LED flexible board light source module provided in this embodiment is further optimized on the basis of the LED flexible board light source module provided in the first embodiment, so most of its structure is the same as that of the LED flexible board light source module provided in the first embodiment. The groups are basically the same or similar, and will not be repeated here, and only the differences will be described below.

[0063] Such as figure 2 As shown, in this embodiment, the LED light source 1 is an LED chip, the LED chip is connected to the soft substrate 2, and the LED chip is packaged on the soft substrate 2 through the lens 5; further, the LED chip and the soft substrate 2 are positively connected.

[0064] The specific installation process is as follows: the LED chip is mounted on the soft substrate 2, and then the LED chip is fixed on the soft substrate 2 through processes such as die bonding, wire bonding, glue dispensing, and curing.

[0065] ...

Embodiment 3

[0071] The LED flexible board light source module provided in this embodiment is further optimized on the basis of the LED flexible board light source module provided in the second embodiment above, so most of its structure is the same as that of the LED flexible board light source module provided in the second embodiment. The groups are basically the same or similar, and will not be repeated here, and only the differences will be described below.

[0072] Such as image 3 As shown, in this embodiment, the LED light source 1 is an LED chip, the LED chip is connected to the soft substrate 2, and the LED chip is packaged on the soft substrate 2 through the lens 5; further, the LED chip and the soft substrate 2 are flip-chip connected.

[0073] Among them, since the LED chip is flip-chip mounted on the soft substrate 2, it can skip the wiring process in the second embodiment, and the LED chip is directly installed on the soft substrate 2 after dispensing, curing and other process...

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PUM

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Abstract

The invention provides an LED flexible board light source module, comprising an LED light source arranged on a flexible substrate, a radiating component on which the flexible substrate is arranged; and an electroconductive component which covers the flexible substrate and the radiating component and is electrically connected with the flexible substrate. An LED light source is mounted on the flexible substrate, then the flexible substrate is arranged on the radiating component, and the electroconductive component is used to be electrically connected with the flexible substrate, so that the LED light source dissipates heat through the radiating component, and realizes electrical conduction through the electroconductive component, thereby further realizing separation of electricity and heat, improving the radiating effect of the LED light source, effectively preventing the problem that light attenuation of the LED light source occurs too early due to poor heat dissipation, ensuring the luminous efficiency of the LED light source, and prolonging the service life of the LED light source.

Description

technical field [0001] The invention relates to the technical field of semiconductor lighting, in particular to an LED flexible board light source module and a manufacturing method thereof. Background technique [0002] LED lamps have the advantages of long life and power saving, so they are more and more used in the field of lighting. [0003] At present, the common LED light source module usually installs the LED light source on the aluminum substrate, and then encapsulates the LED light source on the aluminum substrate through a light-transmitting package. [0004] Since the aluminum substrate in the existing LED light source module is both a heat dissipation component and a conductive component, it is often necessary to arrange a thick insulating layer and a circuit on the aluminum substrate at the same time. The existence of the insulating layer will increase the heat dissipation channel of the LED light source, thereby increasing its thermal resistance and resulting i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/64
CPCH01L2224/48091H01L2224/73265
Inventor 袁长安牛琳韦嘉崔成强张国旗
Owner 北京半导体照明科技促进中心
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