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Lead frame strip for reduced mold sticking during degating

A lead frame and gate removal technology, which is applied in the field of lead frame strip design, can solve problems such as damage to bent or deformed parts

Inactive Publication Date: 2014-02-26
TEXAS INSTR INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the die tends to adhere to all surfaces of the leadframe strip, the removal of the residual gating during the degating process can distort the leadframe strip enough to bend to damage around the leadframe surface These bent or deformed parts of

Method used

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  • Lead frame strip for reduced mold sticking during degating
  • Lead frame strip for reduced mold sticking during degating
  • Lead frame strip for reduced mold sticking during degating

Examples

Experimental program
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Embodiment Construction

[0017] FIG. 1A depicts a semiconductor assembly comprising a known leadframe strip 100 comprising two columns of leadframe points with circular punched degating holes in inner side rails 111 and outer side rails 112. Bit 115 semiconductor components. The inner side rail 111 extends between sub-rails 116 having a length dimension along a first direction 158 perpendicular to a second direction 159 . The sub-rails 116 connect to the outer side rails 112 . Lead frame site 115 includes die pads 125 and a plurality of leads 126 associated with each die pad 125 . A semiconductor die 127 is attached to each die pad 125 (eg, via a die attach material). It can be seen that the sum of the total aperture lengths of the punched degating holes 105 and 106 along the first direction 158 is significantly smaller than the length of the die pad 125 in the first direction 158 .

[0018] Figure 1B Depicted is a semiconductor assembly comprising a leadframe strip 150 comprising two columns of l...

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PUM

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Abstract

A lead frame strip includes an array of sites arranged in at least one row connected to two exterior side rails which traverse the lead frame strip on two opposite sides. Each of the sites is further connected to the two exterior side rails by subrails which extend between the two exterior side rails. Interior side rails extend between the subrails having a length dimension oriented along a first direction. The interior side rails include at least one punch degating aperture having an aperture length oriented along the first direction, wherein a total of the aperture length along the interior side rails is greater than or equal to the die pad length.

Description

technical field [0001] The disclosed embodiments relate to gate removal for removing excess mold compound from an integrated circuit (IC) device after packaging, and more particularly, to reducing leads of mold compound attached to a leadframe in the area of ​​the clear gate Frame strip design. Background technique [0002] During the injection molding assembly process used to manufacture packaged plastic electronic devices, IC devices are encapsulated with a molding compound (eg, epoxy) in order to provide protection for the packaged device from the external environment. This encapsulation process is also called molding process. [0003] The packaging process generally involves placing the IC device in one or more mold cavities at locations that would normally be placed on a substrate strip, such as a die pad of a leadframe strip. The liquid mold compound is then forced through the mold chamber, forming remnant waste, which then flows through a series of mold gates and su...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495
CPCH01L23/49541H01L21/565H01L23/49565H01L24/97H01L2924/1305H01L2924/1461H01L2924/00
Inventor N·J·桑托斯E·D·巴利多A·S·D·潘甘J·G·卡瓦巴布F·S·西德尼
Owner TEXAS INSTR INC