CCD visual para-position method for film para-position machine
A technology of film alignment and visual alignment, which is applied in the fields of optics, instruments, and patterned photoplate-making processes, etc., and can solve the problems of difficult to achieve alignment between flexible circuit boards and films, cumbersome workpiece clamping work, and high manufacturing costs. , to achieve the effects of small footprint, high production efficiency and high production efficiency
Active Publication Date: 2014-03-26
GUANGDONG HUAHENG INTELLIGENT TECH CO LTD
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Problems solved by technology
[0005] However, it can only realize the alignment between the PCB board and the film, and it is difficult to realize the alignment between the flexible circuit board (FPC) and the film. In addition, there are defects such as complex structure, high manufacturing cost, cumbersome work of workpiece clamping, and low processing efficiency.
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[0022] In order to facilitate the understanding of those skilled in the art, the present invention will be further described below in conjunction with the embodiments and accompanying drawings, and the contents mentioned in the embodiments are not intended to limit the present invention.
[0023] like figure 1 and figure 2 Shown is the first embodiment of the CCD visual alignment method for the film alignment machine of the present invention, including a frame 1, a film feeding manipulator 2 installed on the frame 1, a substrate feeding manipulator 3, and a finished product unloading The manipulator 4 and the substrate transfer unit 5, the frame 1 is also equipped with an XY adjustment platform 6 and an alignment device 7, and the alignment device 7 includes a controller and N cameras that are not on the same straight line;
[0024] The upper film, the substrate and the lower film are all provided with N mark points. In this embodiment, N is equal to four, and the alignment ...
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The invention relates to the field of production technology for flexible printed circuits, particularly to a CCD visual para-position method for a film para-position machine. The film para-position machine comprises a machine frame, a film loading mechanical arm, a base material loading mechanical arm, a finished product laying-off mechanical arm and a base material transmission unit, wherein an XY adjustment platform and a para-position device are mounted on the machine frame, and the para-position device comprises a controller and N cameras placed on different lines; N mark points are arranged on the upper film and base material as well as the lower film; the method provided by the invention comprises the steps as follows: putting the lower film on the standard position of the XY adjustment platform, comparing, jointing the base material to the lower film and jointing the upper film to the base material, so as to complete the para-position operation for a set of product. According to the invention, the film and base material can be arbitrarily set by adopting identification points, and the precision of the produced FPC is effectively guaranteed; the upper film, the base material and the lower film can be jointed by a para-position mechanism at the same time, as a result, a highly efficient para-position of the positive film and the negative film can be ensured; the purposes of high production efficiency and high quality of the flexible printed circuit are realized.
Description
technical field [0001] The invention relates to the field of (FPC) flexible circuit board production technology, in particular to a CCD visual alignment method for a film alignment machine. Background technique [0002] In the (FPC) flexible circuit board manufacturing process, the (FPC) flexible circuit board and film need to be aligned before exposure, and then the aligned (FPC) flexible circuit board and film are put into the exposure machine for exposure. In the prior art, pins are generally used for alignment, and alignment holes are punched out at the corresponding positions of the (FPC) flexible circuit board and the film, and then the alignment of the two is achieved by putting the alignment holes on the pins. operate. In the above-mentioned alignment structure, since the diameter of the alignment hole cannot be completely equal to the outer diameter of the pin, the alignment accuracy of the two will inevitably be low, and manual alignment is required, which is inef...
Claims
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IPC IPC(8): G03F9/00H05K3/00
Inventor 张斌梁添贵
Owner GUANGDONG HUAHENG INTELLIGENT TECH CO LTD