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Electronic apparatus and cooling module mounted in that electronic apparatus

A technology for electronic devices and coolants, used in cooling/ventilation/heating retrofits, circuits, electrical components, etc., to solve problems such as installation difficulties, obstructions, and limited installation locations

Inactive Publication Date: 2014-03-26
FUJITSU LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For this reason, if a liquid cooling system is installed in addition to the existing air cooling system, there is a problem that the flow of cooling air supplied by the air cooling system will be blocked by the components of the liquid cooling system, thereby preventing cooling
Therefore, installation is difficult
[0007] In addition, servers or other electronic devices are installed in data centers or computer rooms or other small locations, so the places where they can be installed are limited

Method used

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  • Electronic apparatus and cooling module mounted in that electronic apparatus
  • Electronic apparatus and cooling module mounted in that electronic apparatus
  • Electronic apparatus and cooling module mounted in that electronic apparatus

Examples

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Embodiment Construction

[0046] Hereinafter, the accompanying drawings are used to describe the working mode of the present application in detail based on specific embodiments. Note that, in the embodiments described below, a server module forming a server is described as an example of an electronic device, but the electronic device is not limited thereto. In addition, in the following embodiments, for convenience of description, constituent parts provided with the same function have the same reference numerals.

[0047] Figure 1A It is a perspective view showing the outer shape of a rack server 100 in which a server module 1 provided with a liquid cooling system according to the present application is installed in a cabinet 9 . Rack server 100 is a data processing system. Inside the cabinet 9, one or more server modules 1 are installed. The cooling air for cooling the server module 1 is drawn in from the front surface, cools the internal components of the server module 1, and is discharged from th...

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Abstract

An electronic apparatus includes a fan, a circuit board which is positioned downstream in an airflow to which the fan generates, at least one processer mounted on the circuit board, a radiator which is positioned downstream in the airflow which the fan generates, the radiator cooling a liquid coolant, a pipe unit which includes a heat receiving member in which the coolant flows and coolant piping, the heat receiving member being mounted on the processer, and the coolant piping circulating the liquid coolant between the radiator and the heat receiving member, and at least one memory board on which memory package is mounted, the memory board being mounted on the circuit board, and the memory board and the pipe unit being arranged along a direction perpendicular to a direction to which the fan blows the airflow.

Description

[0001] cross references to related things [0002] This application claims priority from Japanese Patent Application No. 2012-197918 filed on September 7, 2012, and incorporates the entire disclosure of this application by reference. technical field [0003] The present application relates to an electronic device capable of efficiently cooling high heat-generating components arranged in an aligned manner and a cooling module mounted on the electronic device. Background technique [0004] In recent years, servers and other electronic devices have become faster and more advanced in functionality. Such electronic devices are mounted with a large number of electronic components. These electronic devices generate heat accompanying their operation. As one of these electronic devices, today's CPU (Central Processing Unit) consumes increased power due to its higher speed and more advanced functions. As the supplied power increases, the amount of heat generated by the CPU tends to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20H01L23/473
CPCH05K7/20736H05K7/20772H01L2924/0002H05K7/20727H01L2924/00H05K7/20G06F1/20
Inventor 渡边雅之篠部贤二轮岛荣二铃木真纯青木亨匡
Owner FUJITSU LTD
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