A manufacturing process of a touch module with a gf2 double-sided conductive film structure
A conductive film and touch module technology, which is applied in electrical digital data processing, input/output process of data processing, instruments, etc., can solve the problems of thick and cannot be used as a touch screen, etc., and achieve the effect of high yield
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Embodiment 1
[0030] A manufacturing process of a touch module with a GF2 double-sided conductive film structure, which sequentially includes the following steps:
[0031] Step A, dry film lamination: Laminate dry film on both sides of the conductive film, the conductive film includes a base material layer, the front of the base material layer is successively provided with an ITO layer and a metal layer, the base material layer The back is also provided with an ITO layer and a metal layer in sequence, and the dry film is attached to the metal layer;
[0032] Step B, exposure and development: Expose the dry film on both sides of the conductive film, and then develop the exposed product with a developer, and the reacted dry film protects the conductive film;
[0033] Step C, the first etching and stripping: use etching solution to perform the first etching to remove the ITO layer and metal layer not protected by the dry film, and finally use lye to peel off the reacted dry film;
[0034] Ste...
Embodiment 2
[0052] A manufacturing process of a touch module with a GF2 double-sided conductive film structure, which sequentially includes the following steps:
[0053] Step A, dry film lamination: Laminate dry film on both sides of the conductive film, the conductive film includes a base material layer, the front of the base material layer is successively provided with an ITO layer and a metal layer, the base material layer The back is also provided with an ITO layer and a metal layer in sequence, and the dry film is attached to the metal layer;
[0054] Step B, exposure and development: Expose the dry film on both sides of the conductive film, and then develop the exposed product with a developer, and the reacted dry film protects the conductive film;
[0055] Step C, the first etching and stripping: use etching solution to perform the first etching to remove the ITO layer and metal layer not protected by the dry film, and finally use lye to peel off the reacted dry film;
[0056] Ste...
Embodiment 3
[0074] A manufacturing process of a touch module with a GF2 double-sided conductive film structure, which sequentially includes the following steps:
[0075] Step A, dry film lamination: Laminate dry film on both sides of the conductive film, the conductive film includes a base material layer, the front of the base material layer is successively provided with an ITO layer and a metal layer, the base material layer The back is also provided with an ITO layer and a metal layer in sequence, and the dry film is attached to the metal layer;
[0076] Step B, exposure and development: Expose the dry film on both sides of the conductive film, and then develop the exposed product with a developer, and the reacted dry film protects the conductive film;
[0077] Step C, the first etching and stripping: use etching solution to perform the first etching to remove the ITO layer and metal layer not protected by the dry film, and finally use lye to peel off the reacted dry film;
[0078] Ste...
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