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High-temperature-resistant RFID ultra-high frequency washing label capable of being washed many times and production technology

A technology of multiple washing and high temperature resistance, which is applied to record carriers, instruments, and computer parts used in machines. It can solve the problems of chips that cannot resist high temperature, cannot be used multiple times, and has a short service life, and achieves a wide range of applications. The effect of improving efficiency and improving service life

Inactive Publication Date: 2014-03-26
王润兴
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problem that the ultra-high frequency washing label currently on the market is made of double-sided composite packaging of an etched antenna binding chip (Wafer), which has a short service life, the chip cannot resist high temperature, and the chip will be damaged when ironed at high temperature; When washing laundry, the chip is easy to wear out after passing through the high-voltage link; after washing, the antenna is prone to faults, so it cannot be used many times, so it provides a new type of high-temperature resistant RFID ultra-high frequency washing label that can be washed many times and its production craft

Method used

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  • High-temperature-resistant RFID ultra-high frequency washing label capable of being washed many times and production technology

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Embodiment Construction

[0027] The present invention will be further described below in conjunction with accompanying drawing and specific embodiment:

[0028] Such as figure 1 As shown, a high-temperature-resistant RFID ultra-high frequency washing label that can be washed multiple times includes a PCB board 1, a chip 2, a substrate antenna 3, and a sealed protective cover 4. The chip 2 is located on the PCB board 1, and a The substrate antenna 3 is soldered to the eight pins of the chip 2 by tin and fixed on both sides of the PCB board 1, and the sealing protective cover 4 is synthesized twice, and is sealed and fitted on the PCB board 1, chip 2, The substrate antenna 3 is external.

[0029] Preferably, the chip 2 is in the form of MOSP packaging, and can still work for half an hour at a high temperature of 180°C. However, the ordinary chip 2 is in the form of Wafer flip packaging, and can only work at 180°C for 5 seconds.

[0030] Preferably, the substrate antenna 3 is a sp...

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Abstract

The invention provides a high-temperature-resistant RFID ultra-high frequency washing label capable of being washed many times and a production technology. The washing label comprises a PCB, a chip, substrate antennae and a sealing protection cover. The chip is located on the PCB, the pair of substrate antennae are welded to eight pins of the chip in a tin soldering mode and fixed to the two sides of the PCB, the sealing protection cover is obtained through secondary composition, and the sealing cover covers the PCB, the chip and the substrate antennae. The high-temperature-resistant RFID ultra-high frequency washing label capable of being washed many times has the advantages that the washing label is resistant to high temperature, high pressure, strong acids, strong bases, detergent such as tetrachloroethylene, kneading and bending, long in service life and capable of being read in batches, because the product performance is very good in consistency, the reading rate is very high, the reading time is greatly shortened in the using process, and the washing label is wide in using range and can be widely used for washing tracing of clothes, towels, bath towels, cotton quilts, mops, leather, textiles and the like.

Description

technical field [0001] The invention relates to an ultra-high-frequency washing label, in particular to a high-temperature-resistant RFID ultra-high-frequency washing label and a production process that can be washed many times. Background technique [0002] At present, the ultra-high-frequency washing labels on the market are made of double-sided composite packaging of etched antenna-bonded chips (Wafer), which have a short service life, and the chips cannot withstand high temperatures. When ironing at high temperatures, the chips will be damaged; industrial laundry, after high-voltage links , the chip is easy to wear and tear; after washing, the antenna is prone to faults, so it cannot be used many times. Contents of the invention [0003] The purpose of the present invention is to solve the problem that the ultra-high frequency washing label currently on the market is made of double-sided composite packaging of an etched antenna binding chip (Wafer), which has...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/077G06K19/02
Inventor 王润兴
Owner 王润兴
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