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Small broadband multilayer chip antenna

A multi-layer chip and broadband technology, applied in the field of portable wireless communication equipment and mobile communication terminal antenna, to save processing time, facilitate testing and debugging, and reduce production costs

Inactive Publication Date: 2014-03-26
成都成电电子信息技术工程有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Among the existing antenna structures, there is no miniaturized broadband multi-layer chip antenna structure covering the working frequency bands of 2G communication (GSM), 3G communication (CDMA), and 4G communication (LTE).

Method used

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Embodiment Construction

[0017] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0018] Such as figure 1 As shown, the small broadband multilayer chip antenna is characterized in that it includes an LTCC ceramic dielectric body 10, a matching unit 20, a multilayer interconnection unit 30, a coupling unit 40 and an end loading unit 50;

[0019] Such as figure 2 As shown, the matching unit 20 includes a feeding end 201 located at the front end, and multiple sets of inverted L-shaped conductors connected end-to-end through equal-height metal through holes 20A connected to the feeding end 201. The L-shaped conductor forms a two-layer three-dimensional circuit structure at both ends of the metal through hole 20A, and the ends of the last group of inverted L-shaped conductors are connected to the multilayer interconnection unit 30 through the metal through hole 20A;

[0020] In this embodiment, multiple sets of inverted L-shap...

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Abstract

The invention relates to a small broadband multilayer chip ceramic dielectric antenna comprising an LTCC ceramic dielectric body, a matching unit, a multilayer interconnection unit, a coupling unit and an end loading unit. The matching unit comprises a feeding end in the most front end, multiple groups of inverted L-shaped conductors which are connected with the feeding end and are connected end to end through metal holes with the same height. The multilayer interconnection unit comprises two layers of upper radiation element and lower radiation element which are connected through a metal through hole. The upper radiation element and the lower radiation element pass across each other and are distributed on two dielectric layers respectively. The coupling unit is formed by a layer of F-shaped plane structure between the two layers of the multilayer interconnection unit, and multiple resonances are realized by the coupling unit by using interlayer coupling. The small broadband multilayer chip ceramic dielectric antenna has the advantages that the LTCC technology is used, a three-dimensional stereoscopic combined structure with the combination of multilayer interconnection and interlayer coupling is employed, the antenna can work in a wide band, and the miniaturization and packaging are realized at the same time.

Description

technical field [0001] The invention belongs to the technical field of portable wireless communication equipment and mobile communication terminal antennas, and in particular relates to a miniaturized broadband multilayer chip antenna covering working frequency bands of 2G communication (GSM), 3G communication (CDMA) and 4G communication (LTE). Background technique [0002] In recent years, the wireless communication system has been developing rapidly toward large capacity, multi-function, and intelligentization. When 3G wireless communication services are still in development and popularization, the research and development of 4G communication technology has already been carried out in full swing, and is bringing new information industry. Revolution has become one of the commanding heights of international competition. As the evolution from 3G to 4G, LTE is a transition between 3G and 4G technologies. It improves and enhances the air access technology of 3G, and adopts OFDM...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q1/38
Inventor 郑轶徐自强宋世明徐美娟陈绍均
Owner 成都成电电子信息技术工程有限公司
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