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MEMS microphone

A microphone and insulating support technology, applied in the field of microphones, can solve problems such as diaphragm rupture

Inactive Publication Date: 2014-04-02
AAC ACOUSTIC TECH (SHENZHEN) CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the MEMS microphone is powered on, the diaphragm is prone to rupture due to high sound pressure

Method used

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  • MEMS microphone
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Examples

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no. 2 example

[0033] Such as figure 2 As shown, a MEMS microphone 200 includes a substrate 201 and a capacitive unit 203 disposed on the substrate 201 . The base 201 is made of semiconductor material, such as silicon, and has a through back cavity 202 , and an insulating layer 214 is disposed on the upper surface of the base 201 . The capacitor unit 203 is connected to the insulating layer 214 .

[0034] The capacitor unit 203 includes a back plate 204 , and a first diaphragm 205 and a second diaphragm 206 opposite to the back plate 204 and disposed on both sides of the back plate 204 . Insulators 207 are provided between the first diaphragm 205 and the back plate 204 and between the second diaphragm 206 and the back plate 204 . The insulating member 207 separates the first diaphragm 05 from the back plate 204 , and the second diaphragm 206 from the back plate 204 by a certain distance, and forms a first insulating gap 208 and a second insulating gap 209 respectively. A plurality of thr...

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Abstract

The invention provides an MEMS microphone, comprising a substrate and a capacitor system arranged on the substrate, wherein the capacitor system comprises a vibration film and a first back plate and a second back plate which are arranged at two sides of the vibration film respectively; the vibration film forms a first insulation interval and a second insulation interval with the first back plate and the second back plate respectively; the MEMS microphone also comprises a first insulation support part and a second insulation support part which are positioned in the first insulation interval and the second insulation interval respectively; the length of the first insulation support part in the direction pointing to the second back plate from the first back plate is 1 / 3-2 / 3 of the width of the first insulation interval in the same direction; the length of the second insulation support part in the direction pointing to the second back plate from the first back plate is 1 / 3-2 / 3 of the width of the second insulation interval in the same direction. The first insulation support part and the second insulation support part can achieve the functions of limiting the amplitude of the vibration film, so the damage of the vibration film is prevented under the high-sound pressure work state of the MEMS microphone.

Description

【Technical field】 [0001] The invention relates to a microphone, in particular to a MEMS microphone. 【Background technique】 [0002] MEMS microphone is a kind of electric energy sound transducer made by micromachining technology, which has the characteristics of small size, good frequency response characteristics and low noise. With the miniaturization and thinning of electronic devices, MEMS microphones are more and more widely used in these devices. [0003] The MEMS microphone in the related art includes a silicon substrate and a plate capacitor composed of a diaphragm and a back plate, and the diaphragm is opposite to the back plate and separated by a certain distance. The diaphragm vibrates under the action of sound waves, causing the distance between the diaphragm and the back plate to change, resulting in a change in the capacitance of the plate capacitor, thereby converting the sound wave signal into an electrical signal. When the MEMS microphone is powered on, the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/04
Inventor 孟珍奎
Owner AAC ACOUSTIC TECH (SHENZHEN) CO LTD
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