Squeegee tool

A tool and squeegee technology, which is applied in the field of photovoltaic silicon ingot bonding, can solve the problems of affecting the effect of exhaust gas and bonding effect, and achieve the effect of avoiding initial curing, removing air bubbles and improving the effect of diversion.

CN103706581BActive Publication Date: 2016-08-17江苏美科太阳能科技股份有限公司

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Patent Information

Authority / Receiving Office: CN · China
Patent Type: Patents(China)
Current Assignee / Owner: 江苏美科太阳能科技股份有限公司
Publication Date: 2016-08-17

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Abstract

The invention provides a glue scraping tool, which belongs to the technical field of photovoltaic silicon ingot bonding. The technical solution adopted by the squeegee tool of the present invention is: a squeegee tool includes a U-shaped groove, a wing plate and a deflector plate, and the wing plate is connected to both sides of the U-shaped groove and directed toward The outer side is inclined, and the deflector plate forms an acute angle with the bottom plate of the U-shaped groove. When the glue squeegee tool of the present invention is used, the U-shaped groove is inserted into the glass guide groove equipped with resin glue, and the resin glue is processed in time through the guide plate. The wing plates on both sides form a temporary storage container for the resin glue. After the operation is completed, clean off the resin glue from the squeegee tool to improve the diversion effect of the resin glue in the glass guide trough, thereby effectively eliminating air bubbles generated during the bonding process and preventing the initial solidification of the resin glue due to long operation time. , which reduces the bonding strength of the resin glue and ultimately affects the bonding effect of the silicon ingot.

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Description

technical field

[0001] The invention belongs to the technical field of photovoltaic silicon ingot bonding, and in particular relates to a glue scraping tool for cleaning resin glue in a glass diversion groove. Background technique

[0002] In the silicon ingot slicing process, silicon ingot bonding is a key process before silicon material cutting and processing. When silicon ingots are bonded, resin glue is usually used to bond glass pads and silicon ingots. Resin glue is generally made of epoxy resin It is composed of two components with curing agent, which should be mixed in a certain proportion before use. During the adhesive bonding process, air bubbles will be generated and enter the adhesive surface. The air bubbles will turn over to the surface of the silicon ingot during the bonding process. After being pressured, the volume becomes smaller, and the pressure inside the air bubbles is extremely high. During the cutting process, there will be defects such as silicon ...

Claims

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