A large-area preparation method and processing system of a micro-nano structure surface with tunable periodic morphology

A technology of micro-nano structure and processing system, which is applied in the field of large-area preparation method and processing system of micro-nano structure surface with tunable periodic morphology, which can solve the problem of poor tunability, single micro-nano structure morphology, and difficulty in meeting multi-functional surfaces. Processing requirements and other issues, to achieve the effect of simple device and flexible control

Active Publication Date: 2015-10-28
UNIV OF SCI & TECH OF CHINA
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the limitation of the laser interference processing method is that it can only generate an interference field with a fixed period and light intensity distribution, and the resulting micro-nano structure has a single morphology and poor tunability, which makes it difficult to meet the processing requirements of a specially designed multifunctional surface.
In practical applications, large-area non-periodic (or gradually changing periodic) sub-micron fine structures are required in many cases, which poses a challenge to traditional interference processing technology

Method used

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  • A large-area preparation method and processing system of a micro-nano structure surface with tunable periodic morphology
  • A large-area preparation method and processing system of a micro-nano structure surface with tunable periodic morphology
  • A large-area preparation method and processing system of a micro-nano structure surface with tunable periodic morphology

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Effect test

Embodiment 1

[0046] The wavefront control laser interference processing system includes a laser light source 1, an energy attenuator 2, a beam expander 5, a first, a second, and a third mirror 7, 12, 15, and a first and second beam splitters 6, 8, The first, second, third, and fourth half-wave plates 3, 9, 13, 16, the first, second, third, and fourth polarizers 4, 10, 14, 17, wavefront modulation devices 11, CCD camera 20, precision mobile platform 19 and computer 21, such as figure 1 Shown. The half-wave plate and the polarizer are used to control the energy and polarization state of each beam; the wavefront modulation device is used to control the wavefront of the spatial beam; the precision moving platform is used to position and move the sample; the CCD camera is used to monitor the processing process and detection Processing results. The energy of the laser beam emitted by the laser light source 1 is adjusted to an appropriate value through the energy attenuator 2, where the energy at...

Embodiment 2

[0050] The laser light source 1 is selected as a nanosecond pulsed laser with a wavelength of 355nm, the emitted light is divided into three beams and one beam is purely phase modulated by the deformable mirror 11 ( figure 1 ). The three beams are uniformly distributed in space, and their azimuth angles are all 5°, and the polar angles are (0°, 120°, 240°). The polarization directions of the three beams are (-30°, 135°, 300°). When the three beams of spatial light are not phase modulated, the interference pattern is a uniformly distributed rectangular intensity peak ( image 3 ). When the deformable mirror 11 is used to apply a one-dimensional sinusoidal grating ( image 3 ) Phase modulation, the interference image is adjusted to a non-uniform diamond-shaped intensity peak ( image 3 ), which can be used for non-periodic array lithography processing.

Embodiment 3

[0052] The laser light source 1 is selected as a nanosecond pulsed laser with a wavelength of 355nm. The emitted light is divided into three beams and one beam is amplitude modulated by the digital micromirror array 11 ( figure 1 ). The three beams are uniformly distributed in space, and their azimuth angles are all 5°, and the polar angles are (0°, 120°, 240°). The polarization directions of the three beams are (-30°, 210°, 450°). When the three beams of spatial light are not amplitude modulated, the interference pattern is a uniformly distributed circular Gaussian distribution intensity valley ( Figure 4 ). When the digital micromirror array 11 is used to apply a pattern type ( Figure 4 ) Amplitude modulation, the interference image is adjusted to the intensity valley limited by the pattern ( Figure 4 ), which can be used for photolithographic processing of maskless patterned periodic arrays.

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Abstract

The invention discloses a large-area manufacturing method and a processing system for the surfaces of micrometer and nanometer structures with tunable periods and tunable morphologies. A laser interference processing method is a widely applied micrometer and nanometer processing means, but is limited and only can be used for realizing intensity distribution of interference fields with fixed periods and fixed morphologies, accordingly, micrometer and nanometer structures processed by the laser interference processing method have single morphologies and are poor in tenability, and requirements on processing multifunctional surfaces in specific designs cannot be met. The large-area manufacturing method and the processing system have the advantages that the large-area manufacturing method and the processing system aim to overcome the bottleneck of the traditional laser interference processing technology, a wave-front modulation device is used for precisely controlling wave-front phases and vibration amplitudes of beams on the basis of the original multi-beam laser interference processing system, so that preliminarily designed target intensity distribution of interference light fields can be realized, and the large-area micrometer and nanometer structures with the variable periods and the variable morphologies can be finally processed; an effective way can be provided for manufacturing the large-area surfaces of non-periodic and diversified structures on a large scale.

Description

Technical field [0001] The invention belongs to the technical field of micro-processing, and particularly relates to a large-area preparation method and processing system of a micro-nano structure surface with a tunable periodic morphology. Background technique [0002] Laser processing technology is an important micro-nano processing method. It can produce controllable micro-nano structures on the surface of the material through the interaction of light and material. Laser processing technology has the advantages of high efficiency, simplicity, green and pollution-free. Laser processing methods can be divided into direct writing processing and interference processing. Laser direct writing processing technology can prepare fine structures with arbitrary shapes, but the processing process is time-consuming, low in efficiency, and difficult to be used in mass manufacturing. The laser interference processing method generates an interference field through the space-time superposit...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/067
CPCB23K26/0673
Inventor 胡衍雷黄文浩李家文褚家如
Owner UNIV OF SCI & TECH OF CHINA
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