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trimmer

A technology of trimmers and trimming discs, which is applied in the field of trimmers, and can solve the problems that the disassembly structure cannot be used for trimmers, etc.

Active Publication Date: 2017-09-15
EBARA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the conventional detachable structure using magnets cannot be applied to dressers made of non-magnetic materials such as resin

Method used

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Embodiment Construction

[0065] Hereinafter, embodiments of the present invention will be described with reference to the drawings. exist Figure 1 to Figure 16 In , the same reference numerals are assigned to the same components, and their repeated descriptions are omitted.

[0066] figure 1 It is a perspective view showing a dressing device including a dresser for dressing (adjusting) a polishing pad. Such as figure 1 As shown, a polishing pad 2 for polishing a substrate such as a wafer is mounted on a polishing table 1 . The polishing pad 2 is integrally rotated with the polishing table 1 by the polishing table motor 7 connected to the polishing table 1 . The wafer is polished by being pressed against the rotating polishing pad 2 .

[0067] The dresser 9 has a dresser 10 that is in sliding contact with the polishing pad 2, a dresser shaft 13 connected to the dresser 10, an air cylinder 16 provided on the upper end of the dresser shaft 13, and a dresser that rotatably supports the dresser shaft...

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PUM

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Abstract

The present invention provides a dresser that can be easily replaced regardless of the type of material of the dresser. The dresser (50) has: an attachment (30) fixed on the dresser shaft (13); a dressing disc holder (50) detachably mounted on the attachment (30) by magnetic force; and a detachable A trimming disc (70) is installed on the trimming disc holder (50) and has a trimming surface (10a). The attachment ( 30 ) and the dressing disc holder ( 50 ) respectively have magnets ( 35 , 56 ) that generate magnetic force.

Description

technical field [0001] The present invention relates to a dresser for dressing (conditioning) a polishing pad of a polishing device typified by a CMP (Chemical Mechanical Polishing) device. Background technique [0002] A CMP apparatus used in semiconductor manufacturing is an apparatus for polishing wafers. In this CMP apparatus, the surface of the wafer is polished by bringing the wafer into sliding contact with the polishing pad while supplying a polishing liquid to the polishing pad. The polishing pad gradually loses its polishing performance as the wafer is ground. Therefore, it has been conventionally performed to regenerate the surface of the polishing pad by finely chipping off the surface of the polishing pad with a dresser. [0003] The dresser has a dressing disk for dressing the polishing surface of the polishing pad. The pad contact surface of the conditioning disc is composed of diamond abrasive grains, and the polishing pad is scraped off by rubbing the dia...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B53/12B24B37/00
CPCB24B53/017H01L21/304
Inventor 筱崎弘行
Owner EBARA CORP
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