Preparation method of modified epoxy resin for die attach

Abstract

The invention discloses a preparation method of modified epoxy resin for chip bonding agents, and belongs to the technical field of low molecular weight polymer preparation. The preparation method is as follows: under nitrogen protection and normal pressure, adding an initiator into methanol or ethanol, heating up to 60-65 DEG C, then dripping a monomer, reacting thermostatically for 1-5h; removing the solvent, standing until the solvent is fully volatilized to obtain a target product; the monomer is glycidyl methacrylate, and 2-3 acrylate monomers and / or aliphatic olefin monomers, the weight percentage of the glycidyl methacrylate is 20%-35%, and the weight percentage of other monomers is 65%-80%. The low-dispersion low-molecular-weight liquid resin is synthesized by modification of epoxy resin with acrylate, the yield of the product is more than 95%; the modified epoxy resin has anti-ultraviolet anti-yellowing ability, and is conducive to further preparation for non-conductive transparent LED chip bonding agents and high-power conductive chip bonding agents.

Description

technical field [0001] The invention relates to a preparation method of a low molecular weight modified epoxy resin used for thermosetting, anti-yellowing, transparent LED packaging non-conductive chip adhesive, and belongs to the field of low molecular weight polymer preparation methods. Background technique [0002] LED chip packaging technology is one of the core technologies for LED device manufacturing. The high working temperature of the LED chip and the yellowing of the chip adhesive caused by ultraviolet radiation during use lead to a decrease in the output light intensity, which affects the quality and service life of the LED product, which requires the LED chip adhesive to need Use a resin with high light transmittance and strong heat and ultraviolet aging resistance. [0003] Due to the limitations of traditional epoxy resin adhesives in terms of yellowing resistance and high temperature, there are more and more studies on improving epoxy resins by using the adva...

AI Technical Summary

Problems solved by technology

But the current method of modified epoxy resin adopts the solid-phase modification method, so that the molecular weight of modified epoxy resin is large (at 10 5 Above), and mainly in solid state, when used to make chip adhesives, the viscosity is high and the controllability is low. To solve these problems, it is necessary to add unenvironmentally friendly organic solvents, and the volatilization of organic solvents will make the chip adhesive conductive Reduced thermal conductivity and adhesive properties

Therefore, the modified epoxy resin prepared by the solid-phase modification method is mostly used for UV-curable adhesives and LED plastic casings, and cannot be used to prepare low-viscosity chip adhesives suitable for automatic die-bonding machines.