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Preparation method of modified epoxy resin for chip bonding agents

An epoxy resin and adhesive technology, which is applied in the field of low molecular weight polymer preparation, can solve the problems of high viscosity, reduced electrical and thermal conductivity and adhesive performance of chip adhesives, and large molecular weight of modified epoxy resins.

Active Publication Date: 2014-04-09
CHANGCHUN YONGGU TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the current method of modified epoxy resin adopts the solid-phase modification method, so that the molecular weight of modified epoxy resin is large (at 10 5 Above), and mainly in solid state, when used to make chip adhesives, the viscosity is high and the controllability is low. To solve these problems, it is necessary to add unenvironmentally friendly organic solvents, and the volatilization of organic solvents will make the chip adhesive conductive Reduced thermal conductivity and adhesive properties
Therefore, the modified epoxy resin prepared by the solid-phase modification method is mostly used for UV-curable adhesives and LED plastic casings, and cannot be used to prepare low-viscosity chip adhesives suitable for automatic die-bonding machines.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Under nitrogen protection and normal pressure, 50 g of azobisisobutyronitrile was added to 2000 g of solvent; after the temperature was raised to 60° C., 200 g of monomer was added dropwise therein for 10 minutes, followed by constant temperature reaction for 1 hour. The solvent was removed, and the target product was obtained by standing still, with a yield of 98%. The weight ratio of the monomers is glycidyl methacrylate: methyl methacrylate: styrene=1:1.5:1.

[0020] The number average molecular weight of the product measured by GPC was 8507Mw, and the degree of dispersion was 1.8.

Embodiment 2

[0022] Under nitrogen protection under normal pressure, add 500 grams of azobisisobutyronitrile to 2000 grams of solvent; after heating up to 60 ° C, add 600 grams of monomer dropwise to it, dropwise for 30 minutes, and react at constant temperature for 3.5 hours; then add 2000 gram of solvent, stirred for 10min, removed the solvent, and allowed to stand to obtain the target product, with a yield of 97%. The weight ratio of the monomers is glycidyl methacrylate: 4-methyl-1-pentene: ethyl acrylate: styrene=1:1:1.2:1.

[0023] The number average molecular weight of the product measured by GPC was 5746Mw, and the degree of dispersion was 1.4.

Embodiment 3

[0025] Under nitrogen protection under normal pressure, add 300 grams of azobisisobutyronitrile to 2000 grams of solvent; after heating up to 62-65 ° C, add 1000 grams of monomer dropwise, dropwise for 1 hour, and react at constant temperature for 5 hours; Add 1000 g of solvent, stir for 10 min, remove the solvent, and let stand to obtain the target product with a yield of 98%. The weight ratio of the monomers is glycidyl methacrylate: butyl methacrylate: ethyl acrylate: styrene=1:2:1:1.

[0026] The number average molecular weight of the product measured by GPC was 9030Mw, and the degree of dispersion was 1.2.

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Abstract

The invention discloses a preparation method of modified epoxy resin for chip bonding agents, and belongs to the technical field of low molecular weight polymer preparation. The preparation method is as follows: under nitrogen protection and normal pressure, adding an initiator into methanol or ethanol, heating up to 60-65 DEG C, then dripping a monomer, reacting thermostatically for 1-5h; removing the solvent, standing until the solvent is fully volatilized to obtain a target product; the monomer is glycidyl methacrylate, and 2-3 acrylate monomers and / or aliphatic olefin monomers, the weight percentage of the glycidyl methacrylate is 20%-35%, and the weight percentage of other monomers is 65%-80%. The low-dispersion low-molecular-weight liquid resin is synthesized by modification of epoxy resin with acrylate, the yield of the product is more than 95%; the modified epoxy resin has anti-ultraviolet anti-yellowing ability, and is conducive to further preparation for non-conductive transparent LED chip bonding agents and high-power conductive chip bonding agents.

Description

technical field [0001] The invention relates to a preparation method of a low molecular weight modified epoxy resin used for thermosetting, anti-yellowing, transparent LED packaging non-conductive chip adhesive, and belongs to the field of low molecular weight polymer preparation methods. Background technique [0002] LED chip packaging technology is one of the core technologies for LED device manufacturing. The high working temperature of the LED chip and the yellowing of the chip adhesive caused by ultraviolet radiation during use lead to a decrease in the output light intensity, which affects the quality and service life of the LED product, which requires the LED chip adhesive to need Use a resin with high light transmittance and strong heat and ultraviolet aging resistance. [0003] Due to the limitations of traditional epoxy resin adhesives in terms of yellowing resistance and high temperature, there are more and more studies on improving epoxy resins by using the adva...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F220/14C08F220/32C08F212/08C08F220/16C08F210/14C08F218/08C09J163/02C09J133/10C09J133/08C09J9/02C09J9/00
Inventor 郑岩王群刘姝王政孙莉李中亮苏立君
Owner CHANGCHUN YONGGU TECH