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Plasma treatment apparatus and method

A plasma and processing device technology, applied in discharge tubes, electrical components, circuits, etc., can solve the problems of not providing, reducing the plasma generation efficiency, reducing the use efficiency of the electromagnetic field of the induction coil, etc., to achieve the effect of improving the use efficiency of electromagnetic waves

Active Publication Date: 2016-09-07
SEMES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The electromagnetic field generated in the lower part of the induction coil is supplied to the chamber and used to generate plasma, but the electromagnetic field generated in the upper part of the induction coil is not supplied to the inside of the chamber
This device not only reduces the efficiency of the use of the electromagnetic field generated in the induction coil, but also reduces the efficiency of plasma generation

Method used

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  • Plasma treatment apparatus and method
  • Plasma treatment apparatus and method
  • Plasma treatment apparatus and method

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Embodiment Construction

[0034] Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings. The embodiments of the present invention can be modified into various forms, and it should not be construed that the scope of the present invention is limited by the following embodiments. This embodiment is provided to more completely illustrate the present invention to those having ordinary knowledge in the art. Therefore, the shapes of elements in the drawings are exaggerated to emphasize clearer illustrations.

[0035] figure 1 is a cross-sectional view illustrating a substrate processing apparatus according to an embodiment of the present invention.

[0036] refer to figure 1 , the plasma processing apparatus 10 includes a chamber 100 , a substrate support unit 200 , a gas supply unit 300 , a plasma source unit 400 , and a reflection unit 500 . The chamber 100 provides a space where plasma processing is performed, and the substrate supporting unit ...

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Abstract

The invention discloses an apparatus for treating plasma, which comprises a cavity that has a space inside; a substrate supporting unit inside the cavity for supporting the substrate; an air supply unit that supplies process air to the cavity; a plasma source unit above the cavity that has an antenna that provides electromagnetic wave of plasma generated by the process air; a reflective plate above the antenna that reflects the electromagnetic wave provided from the antenna to the opposite of the cavity to the direction of the cavity; and a reflective plate driving part that makes the reflective plate.

Description

technical field [0001] The invention relates to a device and a method for processing a substrate, in particular to a device and a method for processing a substrate by using plasma. Background technique [0002] In the manufacturing process of semiconductor elements, etching, deposition, and cleaning processes use plasma to treat the substrate. In a process using plasma, a process gas is sprayed into a chamber, and plasma is generated from the process gas and supplied to a substrate. [0003] An apparatus for processing a substrate using plasma is disclosed in Korean Patent No. 10-854995. In said prior art, an electromagnetic field is generated in an induction coil (or antenna) provided on a chamber lid to generate plasma from a process gas. [0004] In the induction coil, a radial electromagnetic field is formed. The electromagnetic field generated at the lower portion of the induction coil is supplied to the chamber and used to generate plasma, but the electromagnetic fi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01J37/32
Inventor 哈鲁琼·米利克扬具一教成晓星李守真金炫中
Owner SEMES CO LTD
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