ICN device and method

An inter-core communication and mailbox technology, applied in the field of high-performance chip design, can solve problems such as high complexity, poor scalability, and poor real-time performance, and achieve reduced complexity, reduced communication delay, good scalability and scalability sexual effect

Active Publication Date: 2014-04-16
SANECHIPS TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The present invention provides an inter-core communication device and method to at least solve the problems of high complexity, poor real-time performance, and poor scalability in multi-core applications in the prior art inter-core communication device and method

Method used

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Embodiment Construction

[0039] Hereinafter, the present invention will be described in detail with reference to the drawings and examples. It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.

[0040] In this embodiment, an inter-core communication device is provided, figure 1 is a structural block diagram of an inter-core communication device according to an embodiment of the present invention, such as figure 1 As shown, the inter-core communication device includes a mailbox module 12 and a bus adaptation module 14, and the device will be described below.

[0041] The mailbox module 12 is used to store the message that the message sending core sends to the message receiving core, and notifies the message receiving core to read the message; the bus adaptation module 14 is connected to the above-mentioned mailbox module 12, and is located in the mailbox module and communicates with the Bet...

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Abstract

The invention provides an ICN device and method. The device comprises postbox modules and BA modules. The postbox modules are used for storing messages sent to message receiving cores by message sending cores and informing the message receiving cores of message reading. The BA modules are connected between the postbox modules and the message receiving cores and between the postbox modules and the message sending cores, wherein the message receiving cores and the message sending cores are in communication. The BA modules are used for providing read/write interfaces between the postbox modules and the message receiving cores and between the postbox modules and the message sending cores. According to the ICN device and method, the problems that in the prior art, an ICN device and method are high in complexity and poor in real-time performance, and expandability is poor in the process of multi-core application are solved, so that ICN complexity is remarkably lowered, communication time delays are reduced, and expandability and reducibility are excellent.

Description

technical field [0001] The present invention relates to the field of high-performance chip design, in particular to an inter-core communication device and method. Background technique [0002] As multi-core processors are more and more widely used in various technical fields, their powerful parallel computing capabilities, low power consumption and high integration are gradually accepted by the market. A notable feature of a multi-core processor is that the same task can be decomposed into threads or processes of multiple cores to run in parallel, and this parallelism brings a significant improvement in performance. However, while multi-core processors bring performance improvements, they also bring a series of problems such as frequent inter-core communication tasks and complex multi-core communication management, and as more and more cores are integrated on the same chip, this problem become more and more prominent. Therefore, a high-speed and efficient inter-core commun...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F15/167G06F13/24
CPCG06F15/167G06F9/52G06F9/544G06F9/546G06F13/24G06F2209/521
Inventor 王鹏
Owner SANECHIPS TECH CO LTD
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