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Substrate with built-in components

A technology with built-in substrates and components, applied in semiconductor/solid-state device parts, electrical components, electric solid-state devices, etc., can solve problems such as the inability to maintain the opening position of the mask plate and the corresponding state of the terminal part, and the inability to realize layer-to-layer connection

Inactive Publication Date: 2016-01-06
TAIYO YUDEN KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, when the position deviation of the terminal part exceeds the above-mentioned certain range, even if the component is packaged at a predetermined position in the cavity, the corresponding state between the opening position of the mask and the terminal part cannot be maintained, so that the layer-to-layer alignment cannot be realized. the connection between
The larger the size of the substrate and the smaller the size of the electronic components, the more significant the problem will be. However, Patent Document 1 does not describe how to solve this problem.

Method used

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  • Substrate with built-in components
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  • Substrate with built-in components

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Experimental program
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no. 1 Embodiment approach

[0030] figure 1 It is a side cross-sectional view schematically showing the structure of a component-embedded substrate according to an embodiment of the present invention. figure 2 is along figure 1 A cross-sectional view cut along line [A]-[A] in .

[0031] In addition, in each figure, each axis of X, Y, and Z represents the intersecting three-axis direction, and among them, the Z-axis direction (vertical direction) corresponds to the thickness direction of the substrate. In addition, the structure of each part is shown exaggeratedly for the convenience of understanding, and the size of a component in each figure does not necessarily correspond to the ratio of the size between components.

[0032] The component-embedded substrate 100 of this embodiment includes: a metal base 10 having a cavity 11 for accommodating components; first and second wiring layers 21, 22 laminated on the base 10; 30, which is accommodated in the cavity portion 11.

[0033] The thickness and sha...

no. 2 Embodiment approach

[0055] Figure 4 Among them, (A) to (C) are plan views showing the relationship between the cavity portion and the electronic component in the component-embedded substrate according to the second embodiment of the present invention. Hereinafter, configurations different from those of the first embodiment will be mainly described, and configurations that are the same as those in the above-mentioned embodiment will be denoted by the same reference numerals, and descriptions thereof will be omitted.

[0056] In the component-embedded substrate of this embodiment, the structure of the cavity portion 110 formed on the base layer 10 is different from that of the first embodiment. That is, in this embodiment, the cavity portion 110 for housing the electronic component 40 has: a first opening portion 110a whose opening shape is substantially rectangular; formed at the four corners. These second openings 110b protrude outward from the above-mentioned four corner positions.

[0057] ...

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Abstract

The present invention provides a component-embedded substrate capable of ensuring layer-to-layer connection with a terminal portion of a built-in component. A component-embedded substrate (100) according to an embodiment of the present invention has a metal base layer (10), a wiring layer (21), and an electronic component (30). The base layer (10) has a cavity portion (11) for accommodating parts. A wiring layer (21) is laminated on the base layer (10), and a plurality of via holes (21v) for connecting layers are formed on a region facing the cavity portion (11). The electronic component (30) has: a plurality of terminal parts (31), which are electrically connected to a plurality of via holes (21v); The supporting surface (32a) of the terminal part (31). When the plurality of terminal parts (31) are located at positions deviated from the center of the supporting surface (32a) to the first direction, the component main body (32) is arranged at the first position deviated from the center of the cavity part (11) to the side opposite to the first direction. 2 directions.

Description

technical field [0001] The present invention relates to a component-embedded substrate having a cavity portion for accommodating electronic components. Background technique [0002] The component built-in substrate can increase the packaging density. In addition, compared with the existing component package substrate, the component built-in substrate can reduce the size of the substrate, so that portable devices such as mobile phones, portable electronic dictionaries, and digital cameras can be miniaturized and thinned . [0003] For example, Patent Document 1 below discloses an electronic component built-in multilayer substrate having a metal core substrate having a cavity for accommodating electronic components. The multilayer substrate includes: a core substrate; electronic components accommodated in a cavity of the core substrate and encapsulated by an insulating resin; and a transition layer (transition) formed on an insulating resin film covering the upper surface of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/043
CPCH05K3/4608H05K2201/09063H05K2201/09427H05K2201/09854H01L24/19H01L2224/04105H01L2924/15151H01L2924/12042H05K1/185H01L2924/00H05K1/186
Inventor 长沼正树井田一昭猿渡达郎中村浩
Owner TAIYO YUDEN KK