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Encapsulation of surface mount electronic components, piezoelectric buzzer and encapsulation method

An electronic component, surface mount technology, applied in the manufacture/assembly of electrical components, piezoelectric/electrostrictive devices, piezoelectric/electrostrictive/magnetostrictive devices, etc. Strength weakening and other problems, to achieve the effect of maintaining excellent performance and eliminating unreliable component welding

Active Publication Date: 2016-05-18
GUANGDONG JC TECHNOLOGICAL INNOVATION ELECTRONICS CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problems of the prior art, the embodiment of the present invention provides a package of surface mount electronic components, which can solve the problem of heat resistance of surface mount electronic component housing materials and eliminate the application of high temperature reflow soldering on the base and upper cover of the component housing stress on the bonding surface, and can prevent the separation of the bonding surface and the weakening of the bond strength that may occur after reflow

Method used

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  • Encapsulation of surface mount electronic components, piezoelectric buzzer and encapsulation method
  • Encapsulation of surface mount electronic components, piezoelectric buzzer and encapsulation method
  • Encapsulation of surface mount electronic components, piezoelectric buzzer and encapsulation method

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Embodiment 1

[0031] This embodiment provides a package of surface mount electronic components, see figure 1 , figure 2 and image 3 , the package includes: an upper cover 1 and a base 2, and positioning steps are correspondingly provided on the opposite fastening surfaces of the upper cover 1 and the base 2. The positioning step on 2 realizes the position limitation on the upper cover 1 and the base 2 in the horizontal direction, and prevents the upper cover 1 and the base 2 from staggering and shifting each other in the horizontal direction. There is an accommodating cavity for electronic components between the upper cover 1 and the base 2, that is, a groove is dug on the opposite surface of the upper cover 1 and the base 2, and the groove is a square groove. When packaged electronic components (such as When the piezoelectric buzzer) is installed in the package, the surroundings of the electronic components rest on the steps of the base 2, and when the electronic components and the bas...

Embodiment 2

[0037] This embodiment provides a piezoelectric buzzer, see Figure 4 and Figure 5 , the piezoelectric buzzer is matched with the package provided in Embodiment 1, and after being installed in the package, it is then surface-mounted to other electrical components. The piezoelectric buzzer comprises an upper piezoelectric plate 3a, a lower piezoelectric plate 3b and a metal plate 3c, the upper piezoelectric plate 3a and the lower piezoelectric plate 3b are respectively bonded on the two surfaces of the metal plate 3c, and the metal plate 3c One end has an exposed portion. In this way, when the piezoelectric buzzer is installed in the package, the upper piezoelectric plate 3a, the lower piezoelectric plate 3b and the metal plate 3c are respectively connected to the corresponding electrodes of the package to form a complete circuit.

[0038] Both the upper piezoelectric plate 3a and the lower piezoelectric plate 3b are annular rectangular plates, and the shape and size of the ...

Embodiment 3

[0041] This embodiment provides a packaging method for a piezoelectric buzzer, referring to Figure 6 and Figure 7 , the piezoelectric buzzer described in Embodiment 2 is packaged in the package described in Embodiment 1, wherein the structure of the package and the piezoelectric buzzer has been described in detail in Embodiment 1 and Embodiment 2, here No longer.

[0042] The encapsulation method includes:

[0043] Fix the piezoelectric buzzer in the cavity of the base 2 with silicone. You can pre-paint the silicone on the installation step of the base 2 or brush the silicone on the edge of the piezoelectric buzzer. After meeting the gluing requirements, place the piezoelectric buzzer on the installation step and press it for positioning.

[0044] The exposed portion of the metal plate 3c is brought into adhesive contact with the second bottom electrode 2b via the first conductive adhesive 4d. The first conductive adhesive 4d can be adhered to the exposed part of the met...

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Abstract

The invention discloses a package for surface-mounted electronic components, which includes: an upper cover (1) and a base (2). The upper cover (1) and the base (2) are connected to each other, and there is a storage space for electronic components between them. Cavity; the front end of the upper cover (1) is provided with a first cover electrode (1a), the front end of the base (2) is provided with a first bottom electrode (2a), and the rear end is provided with a second bottom electrode (2b). A piezoelectric buzzer is also disclosed, including an upper piezoelectric plate (3a), a lower piezoelectric plate (3b) and a metal plate (3c). The upper piezoelectric plate (3a) and the lower piezoelectric plate (3b) are respectively Bonded to both sides of the metal plate (3c). And a packaging method of piezoelectric buzzer. Belongs to the field of electronic technology. The invention can solve the problem of heat resistance of surface-mounted electronic component housing materials and eliminate the stress exerted by high-temperature reflow soldering on the bonding surfaces of the component housing base and the upper cover.

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to a package of surface-mounted electronic components, a piezoelectric buzzer used for the package, and a packaging method for the piezoelectric buzzer. Background technique [0002] Piezoelectric electroacoustic components are widely used in electronic devices, household appliances, and portable communication equipment to generate sound alarms or working sounds. With the advancement of science and technology, the volume of electronic devices has been greatly reduced, and surface-mounted piezoelectric electroacoustic components can be directly mounted on circuit boards. For surface mount electronic components, the case and base must have heat resistance above the reflow temperature. At present, the housing materials of surface-mounted piezoelectric sound-generating devices are mostly made of heat-resistant resins, such as LCP (liquid crystal polymer), SPS (syndiotacti...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L41/053H01L41/23G10K9/122G10K9/22H10N30/88H10N30/02
Inventor 欧明姜知水田维周涛文理
Owner GUANGDONG JC TECHNOLOGICAL INNOVATION ELECTRONICS CO LTD