Supercharge Your Innovation With Domain-Expert AI Agents!

A dual-embedded sub-module structure circuit of a modular multilevel converter

A modular multi-level, modular structure technology, applied in the field of power transmission and distribution, can solve the problem that the HBMMC-HVDC system cannot cope with DC faults, and achieve the effect of good DC faults and improved reliability

Active Publication Date: 2016-04-06
NORTH CHINA ELECTRIC POWER UNIV (BAODING)
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the problem that the HBMMC-HVDC system using the half-bridge sub-module structure circuit described in the above technical background cannot cope with DC faults, the present invention proposes a dual-embedded sub-module structure circuit for a modular multilevel converter

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A dual-embedded sub-module structure circuit of a modular multilevel converter
  • A dual-embedded sub-module structure circuit of a modular multilevel converter
  • A dual-embedded sub-module structure circuit of a modular multilevel converter

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] The preferred embodiments will be described in detail below in conjunction with the accompanying drawings. It should be emphasized that the following description is only exemplary and not intended to limit the scope of the invention and its application.

[0024] figure 1 is a typical topology diagram of a modular multilevel converter MMC. figure 1 In the topology of the modular multilevel voltage source converter (MMC), each phase has two upper and lower bridge arms, and each bridge arm is composed of N basic circuits.

[0025] figure 2 It is a circuit diagram of a double embedded sub-module structure of a modular multilevel converter provided by the present invention. figure 2 , the sub-module structure circuit includes 5 insulated gate bipolar transistors (T 1 , T 2 , T 3 , T 4 , T 5 ), five reverse diodes (D 1 ,D 2 ,D 3 ,D 4 、D 5 ), 2 identical capacitors C 1 and C 2 and a separate diode D 6 ;

[0026] Wherein, the five insulated gate bipolar trans...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a novel double-clamping sub-module structure circuit of a modular multilevel converter in the technical field of power transmission and distribution. According to the technical scheme, the sub-module structure circuit comprises five insulated gate bipolar transistors, five reversed diodes, two identical capacitors and one independent diode. The novel double-clamping sub-module structure circuit of the modular multilevel converter is applied to the modular multilevel converter, a system can well handle direct current faults under the condition that few devices are added, currents with the direct current faults can be cut off quickly by locking the converter in bipolar direct current faults on the direct current side, involvement of an alternating current breaker is not needed, and the reliability of the system is improved.

Description

technical field [0001] The invention belongs to the technical field of power transmission and distribution, and in particular relates to a double embedded sub-module structure circuit of a modular multilevel converter. Background technique [0002] In recent years, the modular multilevel converter (Modular multilevel converter, MMC) has developed rapidly, and has been successfully applied in the field of high voltage direct current transmission system (High Voltage Direct Current System, HVDC). MMC uses a large number of fully-controlled devices IGBT, which makes MMC-HVDC (ModularMultilevelConverterBasedHVDC) have many advantages, very suitable for high-voltage, high-power power supply occasions, and has broad application prospects. The half-bridge sub-module (Half-Bridge Sub-Module, HBSM) structure circuit is the optional circuit structure of the main MMC sub-module. Due to the small loss and low cost of HBSM, almost all MMC-HVDC projects are based on the half-bridge type a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H02M7/49
Inventor 赵成勇王朝亮李路遥
Owner NORTH CHINA ELECTRIC POWER UNIV (BAODING)
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com