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Integrated exit runner structure process nozzle

An integrated and nozzle technology, which is applied in the direction of exposure device, spray device, spray device, etc. in the photoplate making process, can solve the problems of uneven spraying of nozzles, large impact on the sprayed surface, and uneven spraying, so as to avoid uneven and uneven spraying. The effect of stability problem, small size, and strong structure and manufacturability

Inactive Publication Date: 2016-04-06
SHENZHEN GRADUATE SCHOOL TSINGHUA UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide an integrated ejection channel structure process nozzle to solve the technical problems of uneven spraying and excessive impact of the spraying liquid on the sprayed surface in the existing chip development process, and the problem that the jet flow caused by the nozzle during use Uneven and unstable spraying caused by road deformation

Method used

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  • Integrated exit runner structure process nozzle
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  • Integrated exit runner structure process nozzle

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Embodiment Construction

[0021] The present invention will be further described below in conjunction with the embodiments and accompanying drawings.

[0022] refer to Figure 1-5 , the process nozzle with integrated exit runner structure includes a nozzle body 1 and a first plate body 2, both of which are elongated. The nozzle main body 1 is provided with an accommodating groove 1b, the length of the accommodating groove 1b is slightly smaller than the length of the nozzle main body 1, and the mouth is rectangular. The first plate body 2 is provided with an exit channel 2a.

[0023] The first plate body 2 is set up sideways, and the nozzle main body 1 is set on the left side of the first plate body 2 and is connected to the first plate surface of the first plate body 2 ( figure 1 in the left panel, Figure 5 The right plate surface) 2b is sealed and combined, that is, the first plate body 2 is arranged opposite to the nozzle body 1 to seal the accommodating tank 1b to form a cavity 3, which is used...

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Abstract

An integrated outgoing flow channel structure process nozzle comprises a nozzle main body and a first plate body, wherein the nozzle main body is provided with an accommodating groove, and the first plate body is provided with an outgoing flow channel. The first plate body and the nozzle main body are oppositely arranged to seal the accommodating groove to form a cavity, the nozzle main body is provided with a liquid supply channel communicated with the cavity, the first plate body is laterally arranged, the outgoing flow channel comprises a vertical outflow slit and a plurality of horizontal blind holes for spraying liquid, the outer ends of the blind holes are connected with the cavity, the inner ends of the blind holes are connected with the outflow slit, and the lower end of the outflow slit penetrates through the lower end face of the first plate body. The process nozzle not only can relieve impact pressure of the sprayed liquid on the sprayed surface and achieve uniform spraying, but also can effectively solve the problem of spraying unevenness and instability caused by outflow slit deformation.

Description

technical field [0001] The invention relates to a nozzle for spraying, in particular to an integrated exit channel structure process nozzle, which is mainly used in the development and spraying process (but not limited to the development process) in the photolithography process in IC (integrated circuit) manufacturing. Background technique [0002] The development methods are generally divided into three categories: immersion development, automatic rotation development, and spin-covering immersion development. Immersion development has a large amount of developer consumption, almost no development process, and the development conditions cannot be kept consistent each time. The quality of the developer will be affected by the development of multiple wafers, and impurities will be mixed in. Now the development coating This method is no longer used. Automatic rotary development and spin-coating immersion development are the most commonly used developing methods at present, bec...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05B1/04B05B1/34G03F7/20
CPCB05B1/044G03F7/30
Inventor 刘学平徐强王汉向东牟鹏段广洪
Owner SHENZHEN GRADUATE SCHOOL TSINGHUA UNIV