A fully automatic pcb electroplating system
A fully automatic, electroplating tank technology, applied in the direction of circuits, electrolytic processes, electrolytic components, etc., can solve the problems of uneven PCB plating and difficult quality assurance, and achieve the effect of novel structural design, avoiding the concentration of power lines, and uniform plating
Active Publication Date: 2016-08-24
黄海
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Problems solved by technology
[0003] Among them, one of the important indicators to measure the quality of PCB electroplating is whether the thickness of the electroplating layer is uniform; however, in the actual electroplating process of the prior art, since the power lines are easy to concentrate at the corners of the PCB, the PCB electroplating is uneven and the quality is very poor. hard to get guarantee
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[0034] The present invention will be described below in conjunction with specific embodiments.
[0035] Such as Figure 1 to Figure 5 As shown, a fully automatic PCB electroplating system includes a PLC controller 1, an electroplating vehicle 2 and an electroplating tank 3, and the electroplating vehicle 2 includes an electroplating vehicle controller 21 and a first antenna 4 electrically connected to the electroplating vehicle controller 21 , the PLC controller 1 is equipped with a second antenna 5 corresponding to the first antenna 4; the electroplating tank 3 includes a tank body 31 and a tank cavity 32 formed on the tank body 31 with the opening facing upwards, and the tank body 31 includes a facing and parallel The left electroplating tank wall 33 and the right electroplating tank wall 34 arranged at intervals, the inner end sides of the left electroplating tank wall 33 and the right electroplating tank wall 34 are respectively equipped with anode conductive bus bars 35, ...
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Abstract
The invention discloses a full-automatic printed circuit board (PCB) plating system, comprising a programmable logic controller (PLC), a plating car and a plating tank, wherein the plating car comprises a plating car controller and a first antenna; the PLC is assembled with a second antenna; two anode conducting busbars, two titanium baskets, two current guide plates and two anode baffle plates are assembled inside a cavity of the plating tank; current guide holes are formed on the current guide plates; the tank body drives the anode baffle plates through a winding motor; and a motor driver and an address block are also assembled on the tank body. The plating car drives the PCB to extend between the two current guide plates when working, and the current guide holes guide a power line to vertically and evenly act on the plating surface of the PCB. By adopting the full-automatic PCB plating system, the winding motor can be automatically controlled to act, so as to drive the anode baffle plates to move up and down to adapt to the size of the PCB. Therefore, the concentration phenomenon of the power line can be avoided by the full-automatic PCB plating system. Thus, even plating of the PCB can be effectively ensured, namely the full-automatic PCB plating system has the advantages of being novel in structure design, and high in automatic degree.
Description
technical field [0001] The invention relates to the technical field of electroplating devices, in particular to a fully automatic PCB electroplating system. Background technique [0002] As a very important electronic product, PCB is widely used in various electronic products; in the process of PCB production and processing, PCB needs to be electroplated. For PCB, the quality of electroplating directly affects the quality of PCB. [0003] Among them, one of the important indicators to measure the quality of PCB electroplating is whether the thickness of the electroplating layer is uniform; however, in the actual electroplating process of the prior art, since the power lines are easy to concentrate at the corners of the PCB, the PCB electroplating is uneven and the quality is very poor. Hard to get a guarantee. Contents of the invention [0004] The purpose of the present invention is to provide a full-automatic PCB electroplating system for the deficiencies of the prior a...
Claims
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IPC IPC(8): C25D19/00C25D21/12C25D7/12
Inventor 黄海
Owner 黄海