Method and special device for manufacturing three-dimensional smart card
A manufacturing method and smart card technology, applied in the field of intelligence, can solve the problems of crushed or deformed three-dimensional case, prone to delamination, and high precision of pressure control
Inactive Publication Date: 2014-05-07
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Problems solved by technology
[0004] Since the grating film guide with three-dimensional patterns is pasted and pressed on the upper substrate, on the one hand, the pressure control accuracy is high, and the three-dimensional pattern on the grating film is easy to be crushed or deformed, and the display of the three-dimensional pattern
At the same time, since the guide film of the grating film and the substrate are fixed by glue, it is easy to delaminate during use
Method used
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[0025] In order to make the purpose, technical solutions and advantages of the invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the invention Examples, not all examples. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0026] The invention provides a method for manufacturing a three-dimensional smart card. The three-dimensional smart card manufacturing method includes:
[0027] Step S10, making the card body, specifically, a chip and an induction circuit connected to the chip signal are provided between the upper substrate and the lower substrate;
[0028] Step S11 , embossing the grating, pla...
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Abstract
The invention relates to the technical field of smart card manufacturing, and discloses a method for manufacturing a three-dimensional smart card. The method includes the step of manufacturing a card body, wherein a chip and an induced circuit connected with the chip in a signal mode are arranged between an upper substrate and a lower substrate; the step of coiling optical grating, wherein a transparent film is placed on the upper substrate or the lower substrate, and the optical grating is formed on the transparent film while lamination is performed. Due to the fact that the optical grating is formed on the transparent film in the lamination process, it is avoided that the optical grating on an optical grating sheet guide film is crushed or deformed by a layer in the lamination process to affect beauty and display of three-dimensional patterns, and production efficiency is improved; according to the optical grating sheet guide film glued on the corresponding substrate through glue, the phenomenon of delamination between the optical grating sheet guide film and the corresponding substrate in the using process can be avoided.
Description
technical field [0001] The invention relates to the field of smart technology, in particular to a method for manufacturing a three-dimensional smart card and a device for manufacturing a three-dimensional smart card. Background technique [0002] There are usually two reading methods for smart cards, one is non-contact, and the other is contact. Among them, the non-contact smart card is equipped with a chip and an induction coil inside, and the information in the corresponding chip is read through the induction coil; for the contact smart card It is to connect the reading and writing equipment with the chip through the exposed contact piece to realize reading and writing. [0003] When manufacturing non-contact smart cards or contact smart cards, the chips and circuit coils are first fixed on the substrate, and then another substrate is placed on the substrate with the chips and coils to press and fix it. When it is necessary to make a three-dimensional card surface, paste ...
Claims
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Inventor 兰荣
Owner 兰荣