Flexible high frequency electronic tag

Abstract

The invention discloses a flexible high-frequency electronic tag. The flexible high-frequency electronic tag includes a tag substrate; the tag substrate comprises a base layer and an additional layer; the base layer is arranged on the upper surface of the additional layer; two ends of the base layer are aligned with two ends of the additional layer; the base layer and the additional layer are connected with a flexible wave absorbing patch at the same side; the flexible wave absorbing patch is a flexible composite material layer of which two surfaces are coated with insulated layers; the lower surface of the additional layer is provided with a conductive connecting piece; a lower part of the conductive connecting piece is connected onto a conductive layer; a power supply connecting line is arranged inside the conductive layer; a capacitance structure is connected with the conductive layer through the power supply connecting line; and the lower surface of the conductive layer is provided with an antenna. The flexible high-frequency electronic tag is convenient to install, and therefore, it can be ensured the electronic tag does not intend to fall off, and therefore, the utilization rate of the electronic tag can be improved, and the service life of the electronic tag can be prolonged; and no intermediate films exist, and therefore, the electronic tag is convenient to manufacture and easy to decode, and the survival rate of the electronic tag is low, and situations such as repeated use can be effectively prevented.

Description

technical field [0001] The invention relates to an electronic tag, in particular to a flexible high-frequency electronic tag. Background technique [0002] At present, in the structure of the EAS electronic tags used in the market, the insulating layer is an essential structure. In the manufacture, the conductive layer needs to be compounded on the insulating layer under high temperature conditions to form the base structure of the label, and its operation is complicated. , the efficiency is low, and due to the compound process, the position of the two-layer conductive layer circuit is prone to deviation, which in turn affects the Q value of the product, making the product encounter difficulties in the decoding process, and it is easy to increase the resurrection rate of the label. At the same time, General electronic labels are made of fragile paper and pasted on the product packaging, but cannot be connected with the product itself, and cannot achieve a complete anti-count...

AI Technical Summary

Problems solved by technology

[0002] At present, in the structure of the EAS electronic tags used in the market, the insulating layer is an essential structure. In the manufacture, the conductive layer needs to be compounded on the insulating layer under high temperature conditions to form the base structure of the label, and its operation is complicated. , the efficiency is low, and due to the compound process, the position of the two-layer conductive layer circuit is prone to deviation, which in turn affects the Q value of the product, making the product encounter difficulties in the decoding process, and it is easy to increase the resurrection rate of the label. At the same time, General electronic labels are made of fragile paper, pasted on the product packaging, but cannot be connected with the product itself, and cannot achieve a complete anti-counterfeiting effect

Images