Device used for plate adsorption and separation

A separation device and board technology, applied in the direction of electrical components, printed circuit manufacturing, printed circuit, etc., can solve the problems of vacuum leakage, inability to adapt to different shapes, and inability to pick up boards, so as to improve the separation efficiency Effect

Inactive Publication Date: 2014-05-14
国际技术开发股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this method has certain defects: (1) Since there are a large number of holes on the surface of some circuit boards, if the suction claw fails to accurately absorb the edge, but adsorbs to the position of the hole on the board, it is easy to cause vacuum leakage, resulting

Method used

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  • Device used for plate adsorption and separation
  • Device used for plate adsorption and separation
  • Device used for plate adsorption and separation

Examples

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Example Embodiment

[0024] Example 1:

[0025] The invention discloses an adsorption and separation device for plates, which combines figure 1 As shown, it includes a metal suction plate 1 and a separating mechanism for separating the paper and the plate. Small holes are uniformly distributed on the suction plate 1. At least one suction device 11 is arranged above the suction plate 1, and the suction device may be a fan or an industrial hose. In actual application, the suction device is connected with a vacuum pump (not shown in the figure). A soft layer 2 is bonded under the suction plate 1 with adhesive. The soft layer 2 in the present invention refers to a material with pores uniformly distributed on the surface, preferably a sponge layer. A net-like anti-slip layer 3 is bonded under the soft layer 2, and the anti-slip layer 3 is a rubber layer. Of course, the soft layer 2 and the non-slip layer 3 can be made of other materials besides the above examples. The suction plate 1 can also be a ce...

Example Embodiment

[0027] Example 2:

[0028] The invention discloses an adsorption and separation device for plates, which includes a porous ceramic suction plate and a separation mechanism for separating paper and plates. Such as figure 2 As shown, the suction plate 1 is provided with a suction mechanism 4, and the suction mechanism 4 is provided with a fan 5, and the number of the fans 5 can be set as required.

Example Embodiment

[0029] Example 3:

[0030] The invention discloses an adsorption and separation device for plates, which includes a suction plate and a separation mechanism for separating paper and plates. Such as image 3 As shown, the suction plate is an electrostatic suction plate, and the electrostatic suction plate includes an upper insulating layer 11, a lower insulating layer 13 and an electrode layer 12 arranged in the insulating layer. The electrode distribution in the electrode layer 12 is as Figure 4 As shown, the electrodes in the electrode layer 12 are arranged to cross each other. The electrostatic suction plate may be porous or non-porous.

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Abstract

The invention provides a device used for plate adsorption and separation. The device comprises an adsorption plate for adsorbing a plate and a separating mechanism used for separating the plate and composite paper. The beneficial effects of the device main lies in that the device can absorb the plate wholly without the limitation of the shape and the size of the plate, and even a multi-hole plated can be well absorbed; the device can automatically separate the plate and the composite paper; and the adsorption and separation efficiency are improved.

Description

technical field [0001] The invention relates to a device for absorbing and separating plates. Background technique [0002] There are many types of circuit boards, including flexible circuit boards and printed circuit boards, in various shapes. Generally, the circuit board is placed on the composite paper, and then stacked layer by layer. The existing separation method is to separate manually, which is inefficient. It is also possible to use the adsorption member to adsorb the end points of the four edges of the plate through the suction claws. However, this method has certain defects: (1) Since there are a large number of holes on the surface of some circuit boards, if the suction claw fails to accurately absorb the edge, but adsorbs to the position of the hole on the board, it is easy to cause vacuum leakage, resulting in failure Suction the board; (2) Due to the size and shape of the circuit board, the existing device cannot adapt to different shapes well; (3) Such adso...

Claims

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Application Information

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IPC IPC(8): H05K3/00
Inventor 浦池勇太
Owner 国际技术开发股份有限公司
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