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Heat radiating module, electronic device and dust removing method thereof

A technology for electronic devices and heat dissipation modules, which is applied to pump devices, parts of pumping devices for elastic fluids, and electrical digital data processing, etc. It can solve problems such as hindering the flow of heat dissipation airflow and affecting the heat dissipation efficiency of air-cooled heat dissipation devices. , to achieve the effect of restoring cooling efficiency

Active Publication Date: 2014-05-14
INVENTEC PUDONG TECH CORPOARTION +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, over time, dust will cover the heat dissipation fins and hinder the flow of heat dissipation airflow, thereby affecting the heat dissipation efficiency of the air-cooled heat dissipation device

Method used

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  • Heat radiating module, electronic device and dust removing method thereof
  • Heat radiating module, electronic device and dust removing method thereof
  • Heat radiating module, electronic device and dust removing method thereof

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Embodiment Construction

[0044] Below in conjunction with accompanying drawing, structural principle and working principle of the present invention are specifically described:

[0045] Please refer to Figure 1 to figure 2 , FIG. 1 is a schematic plan view of an electronic device according to an embodiment of the present invention, figure 2 It is a three-dimensional schematic diagram of the fan in FIG. 1 . The electronic device 5 of this embodiment is suitable for performing a heat dissipation operation or a dust collection operation, which will be described in detail as follows.

[0046] The electronic device 5 of this embodiment includes a first body 7 , a heat dissipation module 10 , a first cover 170 and a second cover 22 . The first body 7 is provided with a keyboard 71 , a socket 72 and a cooling opening 73 . The keyboard 71 faces the second body 6 . The socket 72 and the cooling opening 73 are located on the same side of the first body 7 , and the socket 72 is used for inserting the second c...

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Abstract

Provided are a heat radiating module, an electronic device and a dust removing method thereof. The electronic device comprises a first machine body, a heat radiating module and a cover plate. The first machine body is provided with a heat radiating opening. The heat radiating module includes a fan and a fin group. The fan has a fan shell and a fan blade group arranged in the fan shell. The fan shell is provided with an air inlet, an air outlet and a dust collection gap. The air outlet is communicated with the heat radiating opening. The cover plate is arranged in a position, adjacent to the dust collection gap, of the fan shell. When the fan blade group is rotated, the cover plate covers the dust collection gap, and air flow is suitable for flowing into the air inlet and flowing out of the air outlet. The dust removing method of the electronic device includes the following steps: the air inlet of the fan shell is sealed; then, the cover plate is pivoted towards the fan blade group; and the fan blade group is rotated towards a first rotation direction, and the air flow is suitable for flowing from the air outlet to the outside of the dust collection gap along the first rotation direction.

Description

technical field [0001] The invention relates to a heat dissipation module, an electronic device and a dust removal method thereof, in particular to a heat dissipation module, an electronic device and a dust removal method for cleaning heat dissipation fins. Background technique [0002] As technology in the electronics field continues to evolve, the performance of the electronic components produced is also increasing. However, generally speaking, as the performance of electronic components improves, the heat generated by them will increase. The heat continuously accumulates on the electronic components and causes the temperature of the electronic components to rise. If the heat cannot be effectively removed from the electronic components to lower the temperature of the electronic components, the electronic components will crash or even be burned. Therefore, the problem generally faced by the electronics industry is not to improve performance, but how to effectively remove ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/02H05K7/20
CPCF04D25/0613F04D29/4226F04D29/703G06F1/203
Inventor 林玮义王信义郑懿伦
Owner INVENTEC PUDONG TECH CORPOARTION
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