Electronic device

A technology of electronic devices and heat sources, which is applied in the fields of electrical digital data processing, instruments, cooling/ventilation/heating transformation, etc., can solve the problems that hinder the thinning of mobile computing devices, improve heat absorption efficiency, improve overall strength, reduce noise effect

Active Publication Date: 2014-05-14
INVENTEC PUDONG TECH CORPOARTION +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above-mentioned heat dissipation method by increasing the heat dissipation area of ​​the heat dissipation fins and increasing the power of the fan will cause an additional increase in the internal volume of the mobile computing device to accommodate larger heat dissipation fins and high-power fans.
In this way, it will hinder the development of thinner mobile computing devices

Method used

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Embodiment Construction

[0029] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

[0030] Please refer to figure 1 , Figure 2A and Figure 2B , figure 1 is a structural cross-sectional view of an electronic device according to an embodiment of the present invention, Figure 2A based on figure 1 The structural bottom view of the radiator, Figure 2B based on Figure 2A Perspective view of the radiator.

[0031] The electronic device 10 of this embodiment includes a housing 11 , a heat source 12 and a heat sink 13 . Wherein, the electronic device 10 may be a tablet computer, a mobile phone or other electronic products.

[0032] A circuit board 14 is disposed inside the housing 11 , and the heat source 12 is disposed on the circuit board 14 and located in the housing 11 . The above-mentioned heat source 12 may be a computing chip of a tablet computer, a mobile phone, ...

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Abstract

The invention relates to an electronic device comprising an outer housing, a heat source and a radiator. The heat source is arranged in the outer housing; the radiator is arranged in the outer housing; and the radiator keeps a certain distance away from the heat source. The radiator comprises a housing body, wherein the housing body comprises a plurality of honeycomb-shaped compartments formed by a plurality of separator plates. The honeycomb-shaped compartments are filled with heat-dissipation materials. The radiator absorbs heat of the heat source through thermal radiation.

Description

technical field [0001] The invention relates to an electronic device, especially an electronic device with a radiator. Background technique [0002] With the continuous advancement of science and technology, the daily necessities of modern people are all developing towards digitization and informationization. Take mobile computing devices as an example, such as notebook computers, tablet computers, etc., which are convenient for users to carry, so that users can use them freely in any occasion. [0003] In addition, generally a heat dissipation fin set and a fan are arranged inside the mobile computing device to remove the heat energy generated by the mobile computing device. However, as the performance of mobile computing devices continues to increase, the heat energy generated by the mobile computing devices during computing processing also increases accordingly. In this regard, the heat dissipation rate of the mobile computing device is generally increased by increasing...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20G06F1/20
CPCG06F1/203
Inventor 郑懿伦林铭宏林春龙
Owner INVENTEC PUDONG TECH CORPOARTION
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