Airtight temperature control device

Abstract

The invention discloses an air tightness temperature control device in the field of integrated circuit package. The air tightness temperature control device aims at solving the problem about how to effectively control the pressure, the temperature and the flow velocity of fluid to prevent generation of bubbles when the fluid with a quite low boiling point is used for dissipating heat in an air tightness area so as to improve the heat dissipation efficiency. The air tightness temperature control device comprises side walls, an upper end cover, a lower end cover, a set of O-shaped rings and a set of fast assembling and disassembling parts, wherein the side walls, the upper end cover, the lower end cover and the set of O-shaped rings form an airtight area, the set of fast assembling and disassembling parts are mechanically connected with the end covers and the side walls, and a transmission device is used for opening and closing the airtight area. A set of sensors are arranged in the airtight area, the end covers close the space on one hand, and active devices or passive devices are integrated on the end covers on the other hand. The sensors can effectively detect the speed, the temperature, the pressure and the bubbles of the fluid, solve the problem of the local high temperature caused by generation of the bubbles in the heat dissipation process of the fluid and is much suitable for occasions with a high requirement for heat dissipation in the field of high-density package. The fast assembling and disassembling parts can be used for fast closing the device.

Description

technical field [0001] The invention relates to a technology for temperature control of electronic devices, in particular to an airtight temperature control device applicable to the field of heat dissipation of electronic devices through flowing liquid. Background technique [0002] During the working process of electronic devices, a part of the electric energy driving these electronic components is converted into heat energy and released. Since the performance of electronic components is usually temperature-dependent, if the released heat cannot be discharged in time, it will affect the performance of electronic components and even electronic devices. [0003] With the high frequency and high speed of electronic devices and the continuous development of miniaturization and high density of integrated circuits, the power density of electronic components has increased significantly, while the physical size has continued to shrink, the heat flux density has increased, and the r...

AI Technical Summary

Problems solved by technology

If the air bubbles adhere to the surface of the device, it will hinder the fluid from taking the heat away from the area in time, resulting in local high temperature

In the field of high-density packaging, the distance between devices is very small, and the heat generated per unit volume is very high. In order to improve the heat dissipation efficiency, a fluid with a very low boiling point is usually used for heat dissipation. In this case, the pressure of the fluid, Precise control of temperature, flow rate, and prevention of air bubbles, and no effective solution to the above problems has been found so far

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