System for determining position of bare chip

Abstract

The invention provides a system for determining the position of a bare chip by means of determining the position of a bare chip adsorbed by a suction nozzle, and aims to improve the production efficiency and the yield of bare chips. Reference position marks (41) are arranged at two positions on the upper surface of a wafer pallet (22). Bare chip arrangement position information which is generated in a coordinate system of the wafer pallet is stored in a storage unit in advance, and the wafer pallet takes the positions of the reference position marks as the reference. A camera is used to capture the two reference position marks on the wafer pallet at the specified positions of a bare chip pick device, a shot picture is processed to identify the two reference position marks in a mechanical coordinate system of the bare chip pick device, the positional deviation value between the coordinate system of the wafer pallet and the mechanism coordinate system of the bare chip pick device is calculated, and the bare chip arrangement position information is corrected according to the positional deviation value, and thus the arrangement positions of various bare chips (21) in the mechanical coordinate system of the bare chip pick device are obtained.

Description

technical field [0001] The utility model relates to a bare chip position judging system for judging the position of a bare chip sucked by a suction nozzle. Background technique [0002] For example, as described in Patent Document 1 (Japanese Unexamined Patent Application Publication No. 2006-332417 ), a wafer tray on which stretchable dicing sheets are spread, on which wafers cut in a checkerboard pattern are pasted, is set on a die picker, When using the suction nozzle to pick up the die separated from the wafer on the dicing sheet, lift the sticking part of the die to be adsorbed in the dicing sheet from directly below it with a jacking bottle (die ejector) The sticking part of the die is partially peeled off from the dicing sheet, and at the same time, the die is picked up from the dicing sheet by sucking the die with a suction nozzle. [0003] In this die pickup device, it is necessary to align the suction nozzle with the die every time the die is picked up. Therefore,...

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Problems solved by technology

[0010] However, in the method of using the die adjacent to the notch formed on the edge of the wafer among the plurality of die selected from the dicing sheet as the reference die as in the above-mentioned Patent Document 1, the operator must use Teaching the reference die manually has the disadvantage of low production efficiency

Also, incorrect data corrections can be made due to misspecification of reference dies due to job errors

[0011] On the other hand, in Patent Document 2, a plurality of dedicated reference dies different from the dies used as products are produced on the wafer, so there is a problem that the yield of dies per wafer decreases and the cost increases accordingly. shortcoming

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