Patents
Literature
Patsnap Eureka AI that helps you search prior art, draft patents, and assess FTO risks, powered by patent and scientific literature data.

2results about How to "High precision computing" patented technology

Flow measuring device

PendingCN122743363Ahigh precision computing
The flow measurement device includes: a receiving and detecting unit that detects an ultrasonic signal transmitted from one ultrasonic transceiver and received by another ultrasonic transceiver; a first timer that measures a first time from the time the ultrasonic signal is transmitted from one ultrasonic transceiver until a change timing occurs when the value of a clock pulse changes; a second timer that measures a second time from the time the receiving and detecting unit detects the ultrasonic signal received from the other ultrasonic transceiver until the change timing occurs; and a calculation unit that calculates the flow rate of a fluid based on the first and second times, wherein a driving unit causes the transmission timing of a driving signal when the flow rate calculated by the calculation unit is below a threshold to differ by a predetermined time from the transmission timing when the flow rate exceeds the threshold.
Owner:PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

Injection molding machine and method for detecting the pressure in a mold

PendingCN122180587Ahigh precision computingInjection pressureMolding machine
An injection molding machine (1) is provided with: an injection device (10) that injects a resin material melted by a heating cylinder (11) in which a screw (20) is arranged inside from a nozzle (12); a mold (75) that is composed of a fixed mold (76) and a movable mold (77) and has a cavity (75a) filled with the resin material; a load cell (60) that detects a pressure acting on the screw (20); and a control device (100) that controls a mold internal pressure; the control device (100) has: a pressure loss acquisition section (111) that acquires, as a pressure loss, the pressure detected by the load cell (60) when the resin material is injected from the nozzle (12) in contact with the fixed mold (76) in a state in which the fixed mold (76) and the movable mold (77) are open; an injection pressure acquisition section (112) that acquires, as an injection pressure, the pressure detected by the load cell (60) when the resin material is injected from the nozzle (12) to the cavity (75a) in a state in which the mold (75) is closed; and a virtual mold internal pressure calculation section (114) that calculates a virtual mold internal pressure V by subtracting the pressure loss from the injection pressure.
Owner:SHIBAURA MASCH CO LTD