Heat dissipation base of notebook computer

A notebook computer and heat dissipation base technology, which is applied in the direction of electrical digital data processing, instruments, digital data processing components, etc., can solve the problems of poor heat dissipation, inability to dissipate heat, and affect the service life of the CPU. High thermal effect, compact structure, good cooling effect

Inactive Publication Date: 2014-06-04
EAST CHINA UNIV OF TECH
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the internal heat dissipation effect of notebook computers on the market is relatively poor. When the computer is running for a long time, a large amount ...

Method used

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  • Heat dissipation base of notebook computer
  • Heat dissipation base of notebook computer
  • Heat dissipation base of notebook computer

Examples

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Embodiment

[0025] Example: see figure 1 , figure 2 , image 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 .

[0026] A notebook computer heat dissipation base, comprising a base shell 8, the base shell 8 is a rectangular parallelepiped box, a semiconductor cooling chip 11, the base shell 8 is divided into two relatively independent spaces of a cooling cavity 15 and a heat dissipation cavity 16 by a partition plate 1, and the The periphery of the cooling cavity 15 is provided with a ventilation hole lattice 7, and the turbofan 3, the turbofan casing 6 and the cooling copper plate 2 are installed in the cooling cavity 15, and the lower surface of the cooling copper plate 2 is bonded to the cold surface of the semiconductor refrigeration sheet 11, and the cooling The upper surface of the copper plate 2 has a cooling fin group, one end of the cooling fin group is closed and the other end is docked with the turbofan casing, the closed end of ...

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Abstract

The invention relates to the field of notebook computer heat dissipation, in particular to a heat dissipation base of a notebook computer. The heat dissipation base comprises a base outer shell and a semiconductor chilling plate, the base outer shell is divided into a refrigerating cavity and a heat dissipation cavity which are relatively independent spaces, a turbine fan and a cooling copper plate are installed in the refrigerating cavity, an axial fan and a heat dissipation aluminum plate are installed in the heat dissipation cavity, the cooling copper plate is attached to the cold face of the semiconductor chilling plate, the heat dissipation aluminum plate is attached to the hot face of the semiconductor chilling plate, the cooling copper plate and the heat dissipation aluminum plate are provided with fin sets, a large amount of cooling air is produced through the intensified heat exchanging measure of the turbine fan, the axial fan, the fin sets and a heat pipe and then the interior of the computer can be cooled. The heat dissipation base has the advantages that a refrigerating face and a heat dissipation face are completely and closely attached to the cold face and the hot face of the semiconductor chilling plate in a contact mode respectively, the structure is simple, the heat exchanging effect is higher, and the refrigerating effect is better.

Description

technical field [0001] The invention relates to the field of heat dissipation for notebook computers, in particular to a heat dissipation base for notebook computers. Background technique [0002] At present, the internal heat dissipation effect of notebook computers on the market is relatively poor. When the computer is running for a long time, a large amount of heat accumulates in the CPU accessories and cannot be dissipated, which affects the service life of the CPU and the performance of the notebook computer. Laptop air for cooling. Contents of the invention [0003] The object of the present invention is to solve the above problems, and provide a cooling base for a notebook computer. [0004] In order to realize the purpose of the present invention, the technical scheme adopted in the present invention is: [0005] A heat dissipation base for a notebook computer, including a base shell and a semiconductor cooling chip. The base shell is divided into two relatively ...

Claims

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Application Information

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IPC IPC(8): G06F1/20
Inventor 李凤臣崔鹏飞舒杰张丽娜余祥何春锋陈士军周海迎汤蒂莲王振华柴新军周慧王少文
Owner EAST CHINA UNIV OF TECH
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