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Heat dissipation module

一种散热模组、模组的技术，应用在热交换设备、照明和加热设备、通过传导传热进行修饰等方向，能够解决增加散热模组纵向高度、散热模组无法应用薄型电脑设备、散热效果不佳等问题，达到提升散热效果的效果

Active Publication Date: 2014-06-04
ZHEJIANG HANGHAI NEW TOWN HLDG GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the heat dissipation module only uses the heat sink and heat pipe to dissipate heat for the CPU, and the heat dissipation effect is not good.
If a fan is installed on the heat sink, the vertical height of the heat dissipation module will be increased, so that the heat dissipation module cannot be applied to thin computer equipment

Method used

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Examples

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Embodiment Construction

[0014] see Figure 1 to Figure 2 , In a preferred embodiment of the present invention, a heat dissipation module includes a radiator 10 and an air inlet and outlet module 20 . The heat sink 10 includes a plurality of heat dissipation fins 12 parallel to each other. The air inlet and outlet module 20 includes an air outlet module 100 , a piston module 200 , a casing 300 and an electromagnetic module 400 .

[0015] The air outlet module 100 includes a ventilation module 110 , a baffle 120 and a plurality of first rubber air valves 130 . The ventilation module 110 includes a rectangular parallelepiped body 112 and a plurality of ventilation grooves 1121 provided on the body 112. The front and rear sides of the body 112 have a larger area than the other sides, and the ventilation grooves 1121 penetrate through the body 112. The front and rear sides of the main body 112 are described. The baffle 120 is provided with a plurality of installation holes 122 for installing the first ...

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PUM

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Abstract

Disclosed is a heat dissipation module which includes heat dissipater and an air inlet and outlet module. The air inlet and outlet module and the heat dissipater are arrayed transversely. The air inlet and outlet module includes a casing, an electromagnetic module, a piston module and an air outlet module. The heat dissipater is installed at the outer side of the air outlet module. The casing is of a hollow structure and includes a pair of openings which are in communication with each other and face each other. The electromagnetic module and the air outlet module are installed at the outer sides of the pair of openings respectively. The piston module is installed in the casing and capable of moving back and force between the electromagnetic module and the air outlet module. Air flow generated when the piston module moves flows towards the heat dissipater through the air outlet module. The heat dissipation module is smaller in thickness and better in heat dissipation effect.

Description

technical field [0001] The invention relates to a cooling module. Background technique [0002] A traditional computer motherboard includes a mainboard body, a CPU installed on the mainboard body, and a cooling module installed on the CPU. The heat dissipation module includes a heat sink and at least one heat pipe. The heat sink includes a square bottom surface and a plurality of heat dissipation fins protruding vertically upward from the bottom surface. The bottom surface is provided with arc-shaped grooves. The heat pipe is a bent structure, a part of the heat pipe vertically penetrates the heat dissipation fin, and the other part is fixed in the groove, the heat generated by the CPU is conducted to the heat sink and the heat pipe, and the heat dissipation The cooling fins of the heat sink and the heat pipes all help to dissipate the heat generated by the CPU. However, the cooling module only utilizes the radiator and the heat pipe to dissipate heat for the CPU, and the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20G06F1/20
CPCH05K7/2039G06F1/203H05K7/20136F28F5/00H02K33/18
Inventor 杨志豪曾祥鲲史宝权
Owner ZHEJIANG HANGHAI NEW TOWN HLDG GRP CO LTD
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