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Heat pipe and processing method thereof

A processing method and heat pipe technology, applied in the field of heat conduction, can solve the problems of heat source concentration and component heat generation, and achieve the effect of increasing the capillary pressure difference and increasing the maximum heat transfer capacity.

Active Publication Date: 2014-06-11
IND TECH RES INST
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the evolution of integrated circuit packaging technology and technology, the density of internal circuits has increased and the miniaturization has led to a rapid increase in the speed and frequency of electronic components. The substantial increase in the heat generation per unit area leads to the problem that the heat source is more concentrated on the chip

Method used

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  • Heat pipe and processing method thereof
  • Heat pipe and processing method thereof

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Embodiment Construction

[0050] The technical solution of the present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments to further understand the purpose, solution and effect of the present invention, but it is not intended to limit the scope of protection of the appended claims of the present invention.

[0051] see figure 1 As shown, this figure is a schematic flow chart of the first embodiment of the heat pipe processing method of the present invention. In this embodiment, the method 2 includes step 20 of providing a metal pipe with openings at both ends. Such as figure 2 As shown, this figure is a schematic side view of one end section of the metal pipe body of the present invention. The metal tube body 80 is a cylindrical hollow tube body with a length, and a capillary structure surface 81 on the inner wall. In this embodiment, the capillary structure surface 81 is a groove structure formed on the inner wall of the metal tube. ...

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Abstract

A heat pipe processing method includes steps of providing a metal tube with openings at two ends, where an inner wall of the metal tube has a capillary structure surface; and oxidizing the capillary structure surface so as to form an oxidized structure surface. In another embodiment, a heat pipe includes is provided, including a metal tube, a working fluid, and a first oxidized structure. An inner wall of the metal tube has a first area. The working fluid is filled in the metal tube. The first oxidized structure is formed on the inner wall defined by the first area, and the working fluid has a first contact angle on the first oxidized structure. According to the invention, the feature of a capillary structure surface of an existing heat pipe or vapor chamber is changed through a chemical reaction, so that a working fluid in the heat pipe and a modified capillary structure of an inner wall of the heat pipe have different wettability, thereby improving a capillary pressure difference that is used for driving the working fluid to flow and provided by the capillary structure in the pipe, hence significantly improving the maximum heat transfer rate of the heat pipe.

Description

technical field [0001] The invention relates to a heat conduction technology, in particular to a heat pipe and a processing method thereof. Background technique [0002] With the evolution of integrated circuit packaging technology and technology, the density of internal circuits has increased and the miniaturization has led to a rapid increase in the speed and frequency of electronic components. The substantial increase in heat generation per unit area leads to the problem that the heat source is more concentrated on the chip. Statistical results show that the proportion of all electronic products damaged due to overheating is as high as 55%, and studies have pointed out that every 10°C decrease in temperature can increase the efficiency of computing chips by 1-3%, so electronic components need an effective cooling system during operation It is designed to solve the problem of too concentrated heat source, so that the electronic equipment can maintain its reliability, stab...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/04
CPCF28D15/046C23C8/42F28F2245/04F28F2245/02
Inventor 杜成伟简国祥郑名山
Owner IND TECH RES INST
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