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Track structure of full-automatic transistor die bonder for manufacturing integrated circuit

An integrated circuit, fully automatic technology, applied in the direction of circuits, electrical solid devices, electrical components, etc., can solve the problems of inconvenient machining, affecting the processing effect, unreasonable track structure design, etc., to achieve the effect of reasonable design and simple production

Inactive Publication Date: 2014-06-11
兴化市华宇电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When making an integrated circuit, the transistor is fixed on the integrated circuit by a fully automatic crystal bonder. The track structure design of the current fully automatic transistor bonder is unreasonable, which is not convenient for machine processing and affects the processing effect.

Method used

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  • Track structure of full-automatic transistor die bonder for manufacturing integrated circuit
  • Track structure of full-automatic transistor die bonder for manufacturing integrated circuit
  • Track structure of full-automatic transistor die bonder for manufacturing integrated circuit

Examples

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Embodiment Construction

[0015] Below in conjunction with accompanying drawing, the present invention will be described in further detail:

[0016] Such as figure 1 , 2 , 3, and 4: the track structure of a full-automatic transistor chip bonder for integrated circuit production in this embodiment includes a track plate 1 and a cover plate 2, and the cover plate 2 is fixed on the top of the track plate 1. Wherein the track plate 1 is provided with a track groove 3 and several ventilation holes 6 .

[0017] The top of described cover plate 2 is provided with several square through holes 4, and the top of each described square through hole 4 is provided with backing plate 5, and each described backing plate 5 is fixed on described cover plate 2 and is arranged with described The square through hole 4 communicates with the second through hole 9 .

[0018] An opening 7 is provided on the cover plate 2 and a groove 8 matching the opening 7 is provided at one end of the track plate 1 .

[0019] The workin...

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PUM

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Abstract

According to the technical scheme, the invention discloses a track structure of a full-automatic transistor die bonder for manufacturing an integrated circuit. The track structure comprises a track plate and a cover plate. The cover plate is fixed to the top of the track plate, a plurality of square through holes are formed in the top of the cover plate, a track groove is formed in the track plate, an opening is formed in the cover plate, and a groove matched with the opening is formed in one end of the track plate. The track structure has the advantages that the track structure is reasonable in design and easy to manufacture, and it is guaranteed that a transistor is accurately fixed to the integrated circuit.

Description

technical field [0001] The invention relates to a track structure of a full-automatic transistor bonding machine for manufacturing integrated circuits. Background technique [0002] Integrated circuits have the advantages of small size, light weight, fewer lead wires and soldering points, long life, high reliability, and good performance, and are widely used. Integrated circuits use a certain process to integrate transistors, diodes, resistors Components such as capacitors, inductors, and wiring are interconnected together, fabricated on a small or several small semiconductor chips or dielectric substrates, and then packaged in a tube to become a microstructure with the required circuit functions. [0003] When making an integrated circuit, the transistor is fixed on the integrated circuit by a fully automatic crystal bonder. The track structure design of the currently used fully automatic transistor bonder is unreasonable, which is not convenient for machine processing a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50
CPCH01L24/83H01L2224/8485
Inventor 张长华钱宝龙
Owner 兴化市华宇电子有限公司