Bonding pad structure of ceramic heating piece with temperature control

Abstract

The invention discloses a bonding pad structure of a ceramic heating piece with temperature control. The bonding pad structure of the ceramic heating piece with the temperature control is of a plate structure formed by an upper ceramic piece (1), a middle ceramic piece (2), a lower ceramic piece (3), heating resistors (4), temperature control resistors (5), heating leads (6), temperature control leads (7), heating resistance bonding pads (8) and temperature control resistance bonding pads (9), wherein the ceramic pieces are stacked in sequence, the multiple heating resistors (4) and the multiple temperature control resistors (5) are provided correspondingly, the heating resistors (4) and the temperature control resistors (5) are located on different planes, the heating resistance bonding pads (8) and the temperature control resistance bonding pads (9) are also located on different planes and are located on the same side of the ceramic heating pieces, and the area where the heating resistance bonding pads (8) located and the area where the temperature control resistance bonding pads (9) located are staggered in a stair shape. The density of the welding pads and the density of lead arrangement are reduced to a large extent, printing and lead welding operation is easy, the rate of finished products is ensured, and manufacturing cost is lowered.

Description

technical field [0001] The invention relates to a pad structure of a ceramic heating sheet, in particular to a pad structure of a ceramic heating sheet with temperature control, and belongs to the technical field of electric heating. Background technique [0002] Ceramic heating element is a new generation of high-efficiency, green and environmentally friendly heating device, which is widely used in various heater products such as industrial and agricultural technology, communication, medical treatment, and daily life. It is used to provide heat sources for heating components or directly as heating components. . At present, the ceramic heating element with temperature control on the domestic and foreign markets has a three-layer ceramic chip type or a double-layer ceramic chip type, and the welding pad is located at the end of one of the ceramic chips. , the currently used pad structure is to arrange pads on the surface of the end of the same layer of ceramic sheet, so th...

AI Technical Summary

Problems solved by technology

At present, the ceramic heating element with temperature control on the domestic and foreign markets has a three-layer ceramic chip type or a double-layer ceramic chip type, and the welding pad is located at the end of one of the ceramic chips. , the currently used pad structure is to arrange pads on the surface of the end of the same layer of ceramic sheet, so the surface pads at the end of the ceramic sheet are dense, especially when a ceramic heating sheet has multiple heating resistors. The number of pads is more , the density of the pads is higher, and the printing difficulty is high, resulting in a decrease in yield. At the same time, the number of corresponding leads is also more, and they are all densely distributed on the same plane, resulting in difficulties in lead welding operations, high technical requirements for workers, and further affecting the finished product. rate, resulting in high manufacturing costs

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