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A method for silk screen identification of pcb device packaging library pins

A device packaging and pin technology, used in instruments, special data processing applications, electrical digital data processing, etc. Effect

Active Publication Date: 2018-03-09
P C B A ELECTRONICS WUXI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, none of the existing mainstream software has this function. Designers can only add labels to devices by placing them manually. It takes 3-4 minutes to add character labels to a 20x20pins BGA device, and add silk screen labels to a 208pin QFP device. It takes 2-3 minutes, and it takes 2-3 minutes to add a character mark to an LRM connector, which is cumbersome and inefficient

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  • A method for silk screen identification of pcb device packaging library pins

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Embodiment Construction

[0039] The present invention will be further described below in conjunction with drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only parts related to the present invention are shown in the drawings but not all content.

[0040] Please refer to figure 1 as shown, figure 1 It is a flow chart of a method for silk-screening identification of PCB device package library pins provided by an embodiment of the present invention.

[0041] In the present embodiment, the method for the pin silk screen identification of the PCB device packaging library specifically includes the following steps: one, distinguish the type of device by extracting the characteristic information of different types of devices; two, for each type of device, extract the pin serial number and pad type , pa...

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Abstract

The invention discloses a method for silk screen identification of pins in a PCB device packaging library, which comprises the following steps: distinguishing the types of devices by extracting characteristic information of different types of devices; Dimensions and pad coordinates; distinguish the various orientations, pitches, dimensions, and pin sequences of devices, and convert them into the positions, orientations, and attributes that need to be placed with silk screen marks. The invention can quickly complete the addition of marks, is simple to operate, and has high accuracy and efficiency, greatly shortens the time for creating and optimizing the integrated chip package library and connector package library in the PCB industry, and improves the package library manager's time. Improve work efficiency and reduce work burden.

Description

technical field [0001] The invention relates to the technical field of silk screen marking, in particular to a method for silk screen marking of pins in a package library of PCB devices. Background technique [0002] In the era of highly integrated technology and the development of distributed computing, integrated chips and multi-pin high-speed connectors are used more and more frequently. In the PCB (printed circuit board) industry, the creation of integrated chip package libraries and connector package libraries The time spent on optimization and optimization is no longer a small amount. It has become a customary rule to add silk screen marks to integrated device packages and connector packages. The role of silk screen marks in PCB design, PCB inspection, device soldering, and hardware debugging cannot be ignored. However, none of the existing mainstream software has this function. Designers can only add labels to devices by placing them manually. It takes 3-4 minutes to ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F17/50
Inventor 应朝晖陈传开王永康王锡刚陈懿刘鹍
Owner P C B A ELECTRONICS WUXI