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Polyimide photosensitive resin composition for organic light emitting diode

A technology of photosensitive resin and polyimide, which is applied in the field of polyimide photosensitive resin composition, can solve problems such as low sensitivity, difficulty in adjusting molecular weight and solubility, and reduced yield, and achieve the effect of improving sensitivity

Active Publication Date: 2017-11-07
DONGJIN SEMICHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the past, the polyimide precursor used in the polyimide photosensitive resin composition has applied the technology of protecting with GMA, but it is difficult to adjust the molecular weight and solubility of the polyimide precursor protected by GMA, and there is a problem of gel Due to the problem of reduced yield due to gelation, an improved method is urgently required due to low sensitivity

Method used

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  • Polyimide photosensitive resin composition for organic light emitting diode
  • Polyimide photosensitive resin composition for organic light emitting diode
  • Polyimide photosensitive resin composition for organic light emitting diode

Examples

Experimental program
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Effect test

Embodiment 1

[0092] (Manufacture of polyimide precursor)

[0093] In a 300 ml 4-port reaction vessel, 4 g of DADM (chemical formula 5), ​​7 g of Bis-APAF (chemical formula 6), and 1 g of SiDA (chemical formula 7) were dissolved with 70 g of γ-butyrolactone. In addition, 5 g of 6-FDA (chemical formula 2), 3 g of DOCDA (chemical formula 3), and 3 g of a-BPDA (chemical formula 4), which are dianhydrides, were put into a reaction vessel, stirred and reacted for 1 hour. In order to terminate the reaction at the end, after adding 2g of PA, an additional reaction time was added at 20°C for 1 hour, and a polyimide precursor with a solid content of 30% was produced. After adding 5 g of ECMMA and MGMA as a protective substance and adding 10 g in total to this, TEA was added as a catalyst after heating up to 70° C., and reacted for 24 hours to manufacture a new polyimide precursor.

[0094] (Manufacture of polyimide photosensitive resin composition for OLED)

[0095] 30 parts by weight of the polyi...

Embodiment 2

[0097] In said Example 1, except having used ECMMA10g at the time of manufacture of a polyimide precursor, it implemented by the method similar to said Example 1, and manufactured the polyimide photosensitive resin composition for OLEDs.

Embodiment 3

[0099] In said Example 1, except having used MGMA10g instead of ECMMA, the polyimide photosensitive resin composition for OLED was manufactured by the method similar to said Example 1.

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Abstract

The present invention relates to a polyimide photosensitive resin composition for OLEDs, in particular to a polyimide photosensitive resin composition for OLEDs with the following features, characterized in that it includes: a) including i) polyimide amine precursor, ii) polyhydroxystyrene (poly hydroxy styrene) resin; b) 1,2-quinonediazide compound; c) crosslinking agent; and d) solvent. The polyimide photosensitive resin composition of the present invention uses a polyimide precursor whose molecular weight and solubility can be easily adjusted, is suitable for forming an organic insulating film of an OLED, and can particularly significantly improve sensitivity.

Description

technical field [0001] The present invention relates to polyimide photosensitive resin composition for OLED, more specifically, relates to a kind of polyimide precursor that uses molecular weight and solubility to adjust easily, is suitable for the organic insulating film formation of OLED, especially makes sensitivity Remarkably improved polyimide photosensitive resin composition. Background technique [0002] Recently, in the market, organic light emitting diodes (Organic Light Emitting Diodes, OLED), especially AMOLED (Active matrix OLED, active matrix organic light emitting diode) in display devices have attracted much attention for various reasons. [0003] Generally, an OLED element includes an organic insulating film, and a polyimide photosensitive resin composition is generally used for forming the organic insulating film. [0004] The polyimide precursor used in the polyimide photosensitive resin composition in the past has applied the technology of protecting with...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/022G03F7/004G03F7/039
CPCG03F7/0233G03F7/0236
Inventor 金东明金柄郁尹赫敏金镇祐黄致容
Owner DONGJIN SEMICHEM CO LTD
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