Electronic element pin cutting device for carrying out cutting through laser and application method

Abstract

The invention provides an electronic element pin cutting device for carrying out cutting through a laser and an application method. The electronic element pin cutting device comprises a controller, a vibration sorting machine, a pin cutting machine body, a laser transmitter, an X-axis motor assembly and a Z-axis motor assembly. The laser transmitter is arranged on the Z-axis motor assembly, the Z-axis motor assembly is arranged on the X-axis motor assembly, the Z-axis motor assembly can drive the laser transmitter to move up and down to adjust the cutting height of a pin, the X-axis motor assembly can drive the laser transmitter to move leftward and rightward to cut the pin, and the controller can control the laser transmitter to move. Compared with the prior art, the laser is used for cutting the pin of an electronic element, the electronic element can be prevented from being impacted and can be prevented from damage, multiple pins of the electronic element can be cut off at a time, and cutting efficiency is improved greatly.

Description

technical field [0001] The invention relates to an electronic element processing equipment, in particular to an electronic element cutting device and a using method for cutting by laser. Background technique [0002] In the production process of some electronic components, it is usually necessary to partially cut off the pins of the electronic components, so as to facilitate the insertion and soldering of the electronic components on the circuit board, and to avoid the cutting process of the excessively long pins after soldering, so as to improve The efficiency and automation of circuit board processing. Therefore, the cutting process of electronic components is very important for their subsequent use. At present, the stamping and cutting mechanism is generally used to cut the pins, that is, the pins of the electronic components are cut off by the stamping mechanism, but there are the following defects: [0003] Using a stamping mechanism to cut off the pins of the electro...

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a kind of electronic component leg cutting device that cuts with laser, to solve the problem that the electronic component leg cutting device in the prior art uses a stamping mechanism to cut off the pin of the electronic component to bring impact force to the electronic component, thereby It is easy to cause damage to electronic components, and every time a pin is cut off, the stamping mechanism needs to reciprocate once, which is a technical problem of low efficiency

[0005] Another object of the present invention is to provide the above-mentioned method of using the electronic component leg cutting device for cutting with laser, so as to solve the problem that the electronic component leg cutting device in the prior art uses a stamping mechanism to cut off the pins of the electronic component and cause damage to the electronic component. The impact force is likely to cause damage to electronic components, and the stamping mechanism needs to reciprocate once every time a pin is cut off, which is a technical problem with low efficiency

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