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A method of manufacturing a printed circuit board with an ultra-thick copper layer

A printed circuit board and manufacturing method technology, which is applied in the secondary treatment of printed circuit, the improvement of metal adhesion of insulating substrates, etc. Poor and other problems

Active Publication Date: 2017-07-11
深圳市牧泰莱电路技术有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The object of the present invention is to provide a method for making a printed circuit board with an ultra-thick copper layer, which makes the bonding force between the copper layer and the bonding layer stronger by setting a patterned fixed layer, and the copper layer and the bonding layer Delamination is not easy to occur; to solve the problem of poor bonding between the copper layer and the bonding layer in the existing manufacturing method of the printed circuit board with an ultra-thick copper layer, and delamination is prone to occur between the copper layer and the bonding layer technical issues

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  • A method of manufacturing a printed circuit board with an ultra-thick copper layer
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  • A method of manufacturing a printed circuit board with an ultra-thick copper layer

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Embodiment Construction

[0036] The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the present invention can be practiced.

[0037] Please refer to figure 1 , figure 1 It is a flow chart of a preferred embodiment of a method for manufacturing an ultra-thick copper layer printed circuit board of the present invention. The manufacturing method of the printed circuit board of the ultra-thick copper layer of the present preferred embodiment comprises:

[0038] Step 101, making a patterned fixed layer on one side of the first copper layer and one side of the second copper layer;

[0039] Step 102, performing etching treatment on both sides of the first copper layer and both sides of the second copper layer;

[0040] Step 103, laminating the etched first copper layer and the etched second copper layer by using an adhesive layer;

[0041] Step 104, sequentially performing drilling operations and sinking copper operations on...

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Abstract

The invention relates to a method for manufacturing a printed circuit board with an ultra-thick copper layer, which comprises the steps of: making a patterned fixed layer on one side of the first copper layer and one side of the second copper layer; The etching process is carried out on the side and both sides of the second copper layer; the first copper layer after the etching process and the second copper layer after the etching process are laminated with an adhesive layer; and sequentially on the printed circuit board Drilling operations and copper sinking operations are performed to form traces on printed circuit boards. The bonding force between the copper layer and the bonding layer in the method for manufacturing the printed circuit board with the ultra-thick copper layer of the present invention is strong, and delamination is not easy to occur between the copper layer and the bonding layer.

Description

technical field [0001] The invention relates to the field of circuit board manufacture, in particular to a method for manufacturing a printed circuit board with an ultra-thick copper layer. Background technique [0002] With the continuous development of electronic technology, more and more electronic components are integrated on the printed circuit board, so the requirements for the current conduction capacity and carrying capacity of the circuit are getting higher and higher; and the current conduction capacity and carrying capacity of the circuit The capacity is proportional to the cross-sectional area of ​​the line. The larger the cross-sectional area of ​​the line, the stronger the current conduction capacity and carrying capacity of the line. The size of the cross-sectional area of ​​the line is proportional to the line width and copper thickness. Electronic products require that the line width of the line be as small as possible. Therefore, the current conduction capa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/38
Inventor 彭湘曾红兵
Owner 深圳市牧泰莱电路技术有限公司
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