Structure for suppressing electromagnetic wave interference and flexible printed circuit board with the structure
A flexible printed circuit and electromagnetic wave technology, applied in printed circuit components, electrical components, magnetic field/electric field shielding, etc., can solve problems such as FPC electromagnetic wave interference, system electromagnetic wave noise interference, etc., to achieve weakened interference, good flexibility and reliability flexible effect
Active Publication Date: 2017-04-12
KUSN APLUS TEC CORP
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Problems solved by technology
This is currently the most commonly used method to solve the problem of high-frequency electromagnetic waves. However, it still cannot solve the internal impact of the internal electronic, communication, computer and other original equipment on the soft board due to reflection and full of electromagnetic wave interference, such as the coupling of the magnetic field in the near area. , CPU, LSI (Large-scale integration; large-scale integrated circuit) and other electronic components between the lines adjacent to the FPC cause the problem of FPC electromagnetic wave interference
Especially in highly dense and highly integrated FPC boards, due to the long-term high-frequency and low-frequency electromagnetic cross-interference environment, serious electromagnetic wave noise interference will occur between systems, and these interference sources are difficult to rely on grounding technology or It is isolated by using conductive electromagnetic wave shielding material
Method used
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[0020] Example: such as figure 1 As shown, the electromagnetic wave interference suppression structure 100 of the present invention is composed of an insulating layer 111, an electromagnetic wave absorbing layer 112, an electromagnetic wave shielding layer 113 and a conductive adhesive layer 114. The electromagnetic wave shielding layer 113 has opposite top and bottom surfaces. The electromagnetic wave absorbing layer 112 is formed on the top surface of the electronic wave shielding layer 113, the insulating layer 111 is formed on the top surface of the electromagnetic wave absorbing layer 112, and the conductive adhesive layer 114 is formed on the electromagnetic breaking shielding layer. 113 on the bottom surface. Wherein, the electromagnetic wave absorbing layer 112 contains a soft magnetic material; the electromagnetic shielding layer 113 is a copper layer, and examples of the copper layer include electrolytic copper, rolled copper, and the like.
[0021] Such as figure...
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The invention discloses a structure for inhibition of electromagnetic wave interference, and a flexible printed circuit comprising the same. The structure for inhibition of electromagnetic wave interference is composed of an insulating layer, an electromagnetic wave absorbing layer, an electromagnetic wave shielding layer and a conductive adhesion layer. The electromagnetic wave shielding layer has a top surface and a bottom surface which are opposite to each other. The electromagnetic wave absorbing layer is formed on the top surface of the electromagnetic wave shielding layer. The insulating layer is formed on the top of the electromagnetic wave absorbing layer. The conductive adhesion layer is formed on the bottom surface of the electromagnetic wave shielding layer. The structure for inhibition of electromagnetic wave interference has electromagnetic wave interference shielding and absorbing functions, exhibits excellent softness and flexibility and is especially suitable for being applied to electronic communication products.
Description
technical field [0001] The invention relates to a structure for suppressing electromagnetic wave interference, in particular to a structure for suppressing electromagnetic wave interference for a flexible printed circuit board. Background technique [0002] In order to meet the multi-functional market demand of personal computers and mobile communication products, the structure of flexible printed circuit boards (Flexible Printed Circuit, FPC) needs to be lighter, thinner, shorter, and smaller; and in terms of functions, it needs powerful and high-speed signal transmission . As the distance between the signal transmission lines of the flexible substrate is getting closer and closer, and in recent years, the working frequency of communication electronic products such as smart phones and tablet computers is moving towards high broadband, the working frequency between the wireless communication module components spans from low frequency to low frequency. Between a few MHz and ...
Claims
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IPC IPC(8): H05K9/00H05K1/02
Inventor 洪金贤林志铭林惠峰李建辉
Owner KUSN APLUS TEC CORP