A method of controlling phosphorus doping concentration by using pre-oxidation combined with low temperature-high temperature-low temperature variable temperature diffusion method
A phosphorus-doped, low-temperature technology, applied in the field of solar cells, can solve problems such as PN junction burn-through leakage, poor square resistance uniformity, and single temperature gradient setting method, and achieve improved conversion efficiency, good square resistance uniformity, and good PN The effect of junction properties
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Embodiment 1
[0026] Such as image 3 As shown, taking polysilicon wafer as an example:
[0027] (1) Put the textured silicon wafer into the boat, and at a low temperature of 750°C, feed 2000 sccm / min oxygen and 15000 sccm / min nitrogen for pre-oxidation, and the oxidation time is 7 minutes;
[0028] (2) The temperature is controlled at 750°C, and 800 sccm / min of small nitrogen carrying phosphorus source, 15000 sccm / min of large nitrogen and 200 sccm / min of oxygen are fed for deposition and diffusion push junction for 20 minutes;
[0029] (3) Raise the temperature to 825°C, feed 900 sccm / min of small nitrogen carrying phosphorus source, 15000 sccm / min of large nitrogen and 300 sccm / min of oxygen for deposition, diffusion and pushing, and the time is 15 minutes;
[0030] (4) Cool down to 765°C, feed 900 sccm / min of small nitrogen carrying phosphorus source, 15000 sccm / min of large nitrogen and 300 sccm / min of oxygen for deposition, diffusion and push junction, and the time is 7 minutes;
[...
Embodiment 2
[0038] Such as image 3 As shown, taking polysilicon wafer as an example:
[0039] (1) Put the textured silicon wafer into the boat, and at a low temperature of 750°C, feed 2000 sccm / min oxygen and 15000 sccm / min nitrogen for pre-oxidation, and the oxidation time is 7 minutes;
[0040] (2) The temperature is controlled at 770°C, and 750 sccm / min of small nitrogen carrying phosphorus source, 15000 sccm / min of large nitrogen and 200 sccm / min of oxygen are fed for deposition and diffusion push junction for 20 minutes;
[0041] (3) Raise the temperature to 830°C, feed 800 sccm / min of small nitrogen carrying phosphorus source, 15000 sccm / min of large nitrogen and 300 sccm / min of oxygen for deposition, diffusion and push junction, and the time is 15 minutes;
[0042] (4) Cool down to 790°C, feed 800 sccm / min of small nitrogen carrying phosphorus source, 15000 sccm / min of large nitrogen and 300 sccm / min of oxygen for deposition, diffusion and push junction, and the time is 7 minutes...
Embodiment 3
[0045] Such as image 3 As shown, taking polysilicon wafer as an example:
[0046] (1) Put the textured silicon wafer into the boat, and at a low temperature of 750°C, feed 2000 sccm / min oxygen and 15000 sccm / min nitrogen for pre-oxidation, and the oxidation time is 7 minutes;
[0047] (2) Under the condition of temperature control at 750°C, 700 sccm / min of small nitrogen carrying phosphorus source, 16000 sccm / min of large nitrogen and 200 sccm / min of oxygen are fed for deposition and diffusion pushing for 25 minutes;
[0048] (3) Raise the temperature to 825°C, feed 800 sccm / min of small nitrogen carrying phosphorus source, 16000 sccm / min of large nitrogen and 300 sccm / min of oxygen for deposition and diffusion push junction, and the time is 17 minutes;
[0049](4) Cool down to 765°C, feed 800 sccm / min of small nitrogen carrying phosphorus source, 16000 sccm / min of large nitrogen and 300 sccm / min of oxygen for deposition, diffusion and push junction, and the time is 9 minute...
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