A kind of IC pin coplanarity measurement system and its measurement method based on structured light
A measurement system and coplanarity technology, applied in the direction of measuring devices, optical devices, instruments, etc., can solve the problems of high equipment manufacturing cost, low detection accuracy, slow detection speed, etc., achieve low equipment cost, improve detection accuracy, The effect of improving efficiency
Inactive Publication Date: 2017-01-25
SOUTH CHINA UNIV OF TECH
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Problems solved by technology
[0006] In order to overcome the disadvantages and deficiencies of the existing coplanarity measurement device, such as complex structure, bulky volume, high equipment manufacturing cost, slow detection speed and low detection accuracy, the present invention provides a coplanarity measurement of IC pins based on structured light Compared with the prior art, the system and its measurement method have simple measurement equipment and improved measurement accuracy
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[0028] Such as Figures 1 to 3 shown. The invention discloses an IC pin coplanarity measurement system based on structured light, which includes:
[0029] Graphics projector 1, goniometer, circular line grating sheet, diffuse ceramic calibration plate, A telecentric lens 2, B telecentric lens 4, CCD camera 5 and computer 6; the circular line grating sheet is placed on the graphic In the projector 1; the graphic projector 1 is an LED graphic projector.
[0030] The graphics projector 1 is connected to the A telecentric lens 2, and fixed on the vibration isolation test bench through a clamping device, the light of the graphics projector 1 is perpendicular to the plane of the vibration isolation test bench, and the IC chip to be tested is placed on the graphics projector 1 on a horizontal plane directly below;
[0031] The B telecentric lens 4 is connected to the CCD camera 5, and is fixed on the vibration isolation test bench by the clamping device. Go to the computer 6, dis...
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The invention discloses an IC pin coplanarity measuring system and measuring method based on structured light. The system comprises a graph projector, an angular instrument, a diffusion ceramic calibration plate, a telecentric lens A, a telecentric lens B, a CCD camera and a computer. The graphic projector is connected with the telecentric lens A and is fixed to a vibration isolation testing table through a clamping device, the light of the graphic projector is perpendicular to the plane of the vibration isolation testing table, and an IC chip to be measured is placed on a horizontal plane under the graphic projector. The telecentric lens B is connected to the CCD camera and is fixed to the vibration isolation testing table through the clamping device, and an included angle is formed between the light of the CCD camera and the plane of the vibration isolation testing table. According to the system, IC pin coplanarity measurement can be converted into intelligent measurement based on machine vision, and pin coplanarity measurement on an image is mapped into the height difference between grating strips of the surface of the chip and the surface of a pin. Equipment cost is low, the technical means is simple, convenient and easy to implement, complex formula derivation and computation are eliminated, and testing efficiency is improved.
Description
technical field [0001] The invention relates to the field of integrated circuit packaging, in particular to a system for measuring the coplanarity of IC pins based on structured light and a measuring method thereof. Background technique [0002] With the development of the electronic information industry, integrated circuit electronic components have achieved rapid development. In the production line of electronic integrated circuit components, controlling and improving the surface quality of products has always been the content of the electronics industry's great attention, so the detection of product quality is particularly critical, among which the coplanarity of IC pins is the most important factor affecting the quality of circuit board assembly an important factor. The distance deviation between the lowest pin of an IC device, that is, the lowest pin of an integrated circuit electronic device, and the plane formed by the three highest pins that are not on the same stra...
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IPC IPC(8): G01B11/30
Inventor 陈忠刘文涛张宪民钟球盛
Owner SOUTH CHINA UNIV OF TECH