Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Substrate bonding process and substrate module to be bonded

A technology for laminating substrates and substrates, applied in optics, instruments, nonlinear optics, etc., can solve the problems of acid solution entry, corrosion of circuit metal wires, loss, etc., to reduce the probability of corrosion, reduce pressure difference, and save processes The effect of time and cost

Inactive Publication Date: 2014-07-30
BOE TECH GRP CO LTD +1
View PDF5 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the disadvantage of this approach is that the opening of the peripheral plastic frame will cause acid liquid to enter between the box plastic frame and the peripheral plastic frame during the subsequent thinning process, corroding the circuit metal wires and component switches, causing unnecessary losses

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate bonding process and substrate module to be bonded
  • Substrate bonding process and substrate module to be bonded
  • Substrate bonding process and substrate module to be bonded

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0075] Such as Figure 5 As shown, Embodiment 1 of the substrate bonding process for forming a liquid crystal panel of the present invention includes:

[0076] A peripheral plastic frame 20 is arranged on the surface of the first substrate 10, and a box-shaped plastic frame 30 for sealing liquid crystals is arranged inside the peripheral plastic frame 20. The height of the box-shaped plastic frame 30 is greater than the height of the peripheral plastic frame 20;

[0077] The first substrate 10 is opposite to the second substrate 100, and the side of the first substrate 10 provided with the peripheral plastic frame 20 and the box-forming plastic frame 30 is opposite to the second substrate 100;

[0078] removing the gas between the first substrate 10 and the second substrate 100;

[0079] The first substrate 10 and the second substrate 100 are preliminarily bonded, the box-forming plastic frame 30 is in contact with the second substrate 100, and there is a gap between the peri...

Embodiment 2

[0087] Such as Image 6 As shown, Embodiment 2 of the substrate bonding process for forming a liquid crystal panel of the present invention includes:

[0088] In the middle part of the surface of the first substrate 10', a box-forming plastic frame 30' for sealing liquid crystals is arranged, and a peripheral plastic frame 20' is arranged on the edge of the surface of the second substrate 100', and the height of the box-forming plastic frame 30' is greater than that of the periphery The height of the plastic frame is 20';

[0089] Make the first substrate 10' and the second substrate 100' opposite, the side of the first substrate 10' that is provided with the box plastic frame 30' is opposite to the side that is provided with the peripheral plastic frame 20' of the second substrate 100';

[0090] Excluding the gas between the first substrate 10' and the second substrate 100';

[0091] The first substrate 10' and the second substrate 100' are preliminarily bonded, the box-for...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
heightaaaaaaaaaa
heightaaaaaaaaaa
depthaaaaaaaaaa
Login to View More

Abstract

The invention relates to a substrate bonding process and a substrate module to be bonded, wherein a peripheral rubber frame is arranged on the surface of a substrate of the substrate module to be bonded, boxed rubber frames are arranged in the peripheral rubber frame, and the height of the boxed rubber frames is greater than the height of the peripheral rubber frame. The substrate bonding process includes the following steps that the peripheral rubber frame is arranged on the surface of a first substrate, the boxed rubber frames for sealing liquid crystal are arranged in the peripheral rubber frame, and the height of the boxed rubber frames is greater than the height of the peripheral rubber frame; the air between the first substrate and a second substrate is sucked off; the first substrate and the second substrate are preliminarily bonded; gas is filled in between the first substrate and the second substrate; the first substrate and the second substrate are further bonded. The technical scheme of the invention can prevent the liquid crystal in the boxes from impacting the boxed rubber frames to cause penetration, save process time and cost and decrease the probability that circuit wires and element switches are corroded by acid liquid.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a substrate bonding process and a substrate component to be bonded. Background technique [0002] In the manufacturing process of the existing liquid crystal display panel, the array substrate (TFT) and the color filter substrate (CF) need to be bonded together by a sealing glue. According to the different coating positions of the sealant, the sealant is divided into the main sealant for sealing the liquid crystal in the box and the peripheral sealant for maintaining the stability of the gap between the substrates. Such as figure 1 As shown, in the substrate bonding process of the prior art, the peripheral rubber frame 51 formed by the peripheral sealant of the substrate is usually arranged on the surface of the first substrate 50, and the box formed by the main sealant is arranged inside the peripheral rubber frame 51. Plastic frame 52; make the first substrate 51 and the sec...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/1333G02F1/1339
CPCB32B3/02B32B3/085B32B2307/558B32B2307/714B32B2457/202G02F1/1339G02F1/133354G02F1/133388
Inventor 肖昂宋省勋陈旭
Owner BOE TECH GRP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com