Soldered joint electromigration experiment device
An experimental device and head electromigration technology, which is applied in the field of brazed joint electromigration experimental devices, can solve problems such as batch experiments, long experiment cycle, and single function, and achieve the effect of reducing power supply and experiment time, and efficiently completing electromigration experiments
Active Publication Date: 2014-08-06
BEIJING UNIV OF TECH
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Problems solved by technology
[0005] The purpose of the present invention is to overcome the shortcomings of the above-mentioned electromigration experimental device with single function, long experimental period and incapable of batch experiments
Method used
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Embodiment Construction
[0019] Brazed joint electromigration experimental device is characterized in that the device is placed in parallel with two rows of self-made fence-type terminals, and the length of the copper rod connecting the two rows of terminals and the required amount can be freely selected according to the length of the joint and the number of samples required for the experiment. The number of terminals, the first pin of the two rows of terminals that are firmly connected is reserved for the first level of the power supply, and the first pin opposite to it and the second pin on the same side are bent using needle-nose pliers. For its contact, use an electric soldering iron and welding wire to weld it firmly, and then weld the second and third pins on the same side of the first pin firmly, and weld the pins firmly in turn according to the principle of sequential conduction. The number of selected copper rods is 2, the cross-sectional area is 3mm×3mm, and the length is selected according t...
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The invention provides a soldered joint electromigration experiment device and belongs to the technical field of material connection. Two rows of fence type terminal blocks are arranged in parallel, the lengths of copper bars connecting the two rows of terminal blocks and the number of needed terminal blocks are selected according to the lengths of joints and the number of samples needed for an experiment, pins are firmly soldered according to the principle of sequential breakover, the number of the copper bars is two, and the selected two copper bars are used for fixing the two rows of terminal blocks which are parallel through copper gaskets on the terminal blocks and screws. Samples are fixed between the two rows of terminal blocks in parallel through the copper gaskets on the terminal blocks and screws, and therefore currents can be connected to a large amount of joints through the copper bars, the samples and the soldered pins. Accordingly, an electromigration device is set up. The number and time of soldered joint electromigration experiments can be controlled, and the electromigration experiment for soldered joints can be effectively achieved in a batched mode.
Description
technical field [0001] The invention relates to a new electromigration experiment device for brazed joints, which belongs to the technical field of material connection, is suitable for large-scale electromigration experiments of brazed joints, and is applied to the reliability research of microelectronics connection electricity. The device can control the quantity and time of electromigration experiments of brazed joints, and reduce the quantity of power sources and experiment time required in electromigration experiments. Realize batch and efficient completion of electromigration experiments for brazed joints. Background technique [0002] Microelectronic connections play a dual role of mechanical connection and electrical connection in electronic products. The reliability of connection joints determines the service life of electronic products. Therefore, the research on the reliability of microelectronic connections in mechanics, heat and electricity has always attracted m...
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Login to View More IPC IPC(8): B23K3/08B23K3/00
CPCG01R31/00
Inventor 郭福乔雷左勇马立民舒雨田汉晶
Owner BEIJING UNIV OF TECH