Method for building SMT welding spot IMC thermal fatigue probability failure physical model

A technology of probabilistic fault physics and physical models, applied in the direction of electrical digital data processing, special data processing applications, instruments, etc.

Active Publication Date: 2014-08-13
BEIHANG UNIV
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  • Abstract
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  • Application Information

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Problems solved by technology

The direct relationship between solder joint life distribution parameters, process parameters and structural parameters has not been established at home and abroad, that is, the method of considering the physical model of IMC solder joint thermal fatigue probability failure

Method used

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  • Method for building SMT welding spot IMC thermal fatigue probability failure physical model
  • Method for building SMT welding spot IMC thermal fatigue probability failure physical model
  • Method for building SMT welding spot IMC thermal fatigue probability failure physical model

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Embodiment Construction

[0052] The present invention will be further described in detail below in conjunction with the accompanying drawings and examples.

[0053] The following example is a probabilistic analysis of the thermal fatigue failure mechanism of the surface-mounted solder joints of the chip component 1206, mainly including establishing the IMC growth model, determining the functional relationship between the thickness of the IMC and the thermal fatigue life of the surface-mounted solder joints, and obtaining the welding process, The probabilistic failure physical model between the working conditions of surface-mount solder joints and the thermal fatigue life of surface-mount solder joints determines the reliability and average working time before failure of surface-mount solder joints.

[0054] A method for establishing a surface-mounted solder joint IMC thermal fatigue probability failure physical model of the present invention, such as figure 1 As shown, the specific steps are as follows:...

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Abstract

The invention provides a method for building an SMT welding spot IMC thermal fatigue probability failure physical model. The method includes the following steps of determining an IMC growth physical model, (2) determining a physical model of the relation between SMT welding spot thermal fatigue service life and IMC thicknesses, and (3) determining IMC thickness distribution probability density function mu (delta). After the preceding three steps are carried out, by means of intermetallic components, namely the bond IMC, the function relation between SMT welding spot reliability and the SMT welding spot machining process and between SMT welding spot reliability and work conditions is directly built; considering dispersion of the IMC thicknesses, discretization is carried out on different products or identical products of different batches, and the SMT welding spot IMC thermal fatigue probability failure physical model is built. According to the method, the relation between the SMT welding spot reliability and process conditions is directly built, and bases are provided for improving the production welding process, the SMT welding spot work environment, prolonging SMT welding spot thermal fatigue service life and improving reliability of welding electronic products.

Description

technical field [0001] The invention provides a method for establishing a surface-mounted solder joint IMC thermal fatigue probability failure physical model, which is to establish the IMC by studying the relationship between the thickness of the welding interface intermetallic compound (IMC) and the welding process and the working conditions of the surface-mounted solder joint. The thermal fatigue probability failure physical model of surface-mount solder joints in the working process provides a basis for evaluating the reliability of surface-mount solder joints, and belongs to the technical field of reliability assessment based on failure physics. Background technique [0002] In electronic packaging technology, interconnection solder joints play the role of transmitting signals, providing heat dissipation channels, connecting and supporting electronic components and circuit boards, and their reliability is extremely critical. The failure of solder joints may cause a devic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
Inventor 陈颖高蕾杨柳王自力
Owner BEIHANG UNIV
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