Flexible and hard composite circuit board and manufacturing method thereof

A technology of soft-hard composite and manufacturing methods, which is applied in the directions of printed circuit components, structural connection of printed circuits, and assembly of printed circuits with electrical components, which can solve the problem of inability to meet the structural thickness and volume of light, thin, and soft-hard composite circuit boards. Increase and other problems, to achieve the effect of light and thin thickness, reduce the difficulty of alignment, and save the production process time

Active Publication Date: 2014-08-13
UNIMICRON TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this design will increase the thickness and volume of the rigid-flex circuit board structure after subsequent assembly, which cannot meet the current trend of light, thin, short and small electronic products.

Method used

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  • Flexible and hard composite circuit board and manufacturing method thereof
  • Flexible and hard composite circuit board and manufacturing method thereof
  • Flexible and hard composite circuit board and manufacturing method thereof

Examples

Experimental program
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Embodiment Construction

[0047] Figure 1 to Figure 9 It is a schematic cross-sectional view of a manufacturing method of a rigid-flex circuit board according to an embodiment of the present invention. Please refer to figure 1 , The manufacturing method of the rigid-flex circuit board 100 of this embodiment includes the following steps. Firstly, a rigid circuit board 110 is provided. The rigid circuit board 110 includes a plurality of conductive layers 112 , a plurality of dielectric layers 114 and a plurality of conductive vias 116 . The conductive layers 112 and the dielectric layers 114 are stacked alternately, and the conductive vias 116 are located between adjacent conductive layers 112 . In other words, the conductive via 116 penetrates through the dielectric layer 114 and electrically connects the adjacent conductive layer 112 . In this embodiment, the structure of the rigid circuit board 110 can be regarded as a build-up circuit structure, and the present invention does not limit the stack...

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PUM

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Abstract

The invention discloses a flexible and hard composite circuit board and a manufacturing method thereof. The manufacturing method provides a circuit board. An insulating layer and a flexible circuit board are provided. The insulating layer is arranged on the flexible circuit board. The insulating layer is provided with an opening and the opening exposes part of the flexible circuit board. A plurality of first conductive holes are formed in the insulating layer, wherein one end of each first conductive hole is connected with the flexible circuit board. The hard circuit board, the insulating layer and the flexible circuit board are laminated so that the insulating layer is connected between the hard circuit board and the flexible circuit board. An enclosed area is defined among the opening of the insulating layer, the hard circuit board and the soft circuit board. The other end of each first conductive through hole is connected with the hard circuit board. The enclosed area is used as a positioning reference point to remove part of the hard circuit board above the opening so as to expose part of the flexible circuit board.

Description

technical field [0001] The invention relates to a circuit board, and in particular to a method for manufacturing a soft-hard composite circuit board. Background technique [0002] Circuit boards can be divided into rigid circuit boards and flexible circuit boards according to the flexibility of the insulating layer. However, when electronic components are to be soldered to the flexible circuit board, the flexible circuit board cannot provide sufficient structural strength. In the same situation where soldering of electronic parts is required, although the rigid circuit board provides structural strength, the flexibility of the rigid circuit board is not good, thus limiting the application of the rigid circuit board. [0003] Rigid-flex composite circuit board is a kind of circuit board composed of flexible circuit board and rigid circuit board, which has both the flexibility of flexible circuit board and the strength of rigid circuit board. In the production of an existing...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/36H05K1/14
Inventor 陈启翔叶铮承黎昆武吴方平
Owner UNIMICRON TECH CORP
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