Supercharge Your Innovation With Domain-Expert AI Agents!

A diode immersion tin device and its use method

A diode and immersion tin technology, which is applied in the field of diode immersion tin devices, can solve the problems of low work efficiency, uneven tin plating, and affecting the mass production of diodes, etc., and achieve the effect of simple structure, uniform immersion tin, and high work efficiency

Active Publication Date: 2016-08-03
GUIZHOU YAGUANG ELECTRONICS TECH
View PDF4 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the diode production workshop, the diode needs to be dipped in tin. The traditional process is to handle it manually, that is, to clamp the diode with pliers, and then put it into the tin bath for tin plating. This purely manual method There are problems of uneven tin plating and low work efficiency, which have seriously affected the batch production of diodes. Therefore, it is the main content of the present invention to study a method that can uniformly tin-plate diodes in batches.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A diode immersion tin device and its use method
  • A diode immersion tin device and its use method
  • A diode immersion tin device and its use method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0024] refer to Figure 1 to Figure 4 , the diode immersion tin device of the present invention comprises a tin immersion plate 1 and a fixing plate 7 with 9 tin immersion holes, the upper part of the immersion tin hole is made as a hexagonal hole 2 matching the diode head, and the lower part of the immersion tin hole is made as a The lead hole 3 matched with the diode lead wire is used to put the diode into the tin dipping hole, and a clamping device is installed on both sides of the dipping tin plate 1, and the clamping device includes an inverted tin plate fixed on the tin dipping plate 1 The buckle block 4 and the bolt 5 located on the undercut plate 4, the bolt 5 cooperates with the screw hole on the undercut block 4, the bolt 5 can spiral down to fix the fixed plate 7, and the fixed plate 7 has a U-shaped Mouth 8.

[0025] Among the present invention, the material of the dipped tin plate 1 and the fixed plate 7 is steel, and the surfaces of the dipped tin plate 1 and th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a diode dipping tin device and a use method thereof, comprising a tin dipping plate and a fixing plate with a tin dipping hole, the upper part of the tin dipping hole is a hexagonal hole matching the diode head, and the lower part of the tin dipping hole The two sides of the tin-impregnated plate are provided with clamping devices for clamping the fixed plate, which are lead holes matched with the diode lead wires. The present invention can place multiple diodes on the dipping tin plate and soak tin at the same time, and due to the structural characteristics that the upper part of the dipping hole matches the diode head and the lower part matches the lead wire, the tin dipping is more uniform. Generally speaking, the present invention has working efficiency High, good immersion tin quality characteristics, can be widely used in the field of diode immersion tin.

Description

technical field [0001] The invention relates to a diode immersion tin device and a use method, belonging to the technical field of diode immersion tin. Background technique [0002] In the diode production workshop, the diode needs to be dipped in tin. The traditional process is to handle it manually, that is, to clamp the diode with pliers, and then put it into the tin bath for tin plating. This purely manual method There are problems of uneven tin plating and low work efficiency, which seriously affect the batch production of diodes. Therefore, it is the main content of the present invention to study a process that can uniformly tin-plate diodes in batches. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a diode immersion tinning device and a method of use, which can perform batch tinning on diodes and uniform tinning at the same time, so as to overcome the deficiencies of the prior art. [0004] Technical sch...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C23C2/08C23C2/34H01L21/67
Inventor 李响华杨华周斌
Owner GUIZHOU YAGUANG ELECTRONICS TECH
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com